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Non-destructive damping measurement for wafer-level packaged microelectromechanical system (MEMS) acceleration switches / Ryan Knight and Evan Cheng.
Connect to full text Available online
View online- Format:
- Book
- Government document
- Author/Creator:
- Knight, Ryan, author.
- Cheng, Evan, author.
- Series:
- ARL-TR (Aberdeen Proving Ground, Md.) ; 7094.
- ARL-TR ; 7094
- Language:
- English
- Subjects (All):
- Microelectromechanical systems.
- Microelectronic packaging.
- Semiconductor wafers.
- Micro-Electrical-Mechanical Systems.
- Medical Subjects:
- Micro-Electrical-Mechanical Systems.
- Physical Description:
- 1 online resource (v, 29 pages) : color illustrations.
- Place of Publication:
- Adelphi, MD : Army Research Laboratory, September 2014.
- Notes:
- Title from title screen (viewed Sept. 29, 2015).
- "September 2014."
- Includes bibliographical references (page 26).
- OCLC:
- 922548626
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