2 options
Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate / Ali Abdul-Aziz, Ramakrishna T. Bhatt, Morris Girgis.
Connect to full text Available online
View online- Format:
- Book
- Government document
- Author/Creator:
- Abdul-Aziz, Ali, author.
- Bhatt, Ramakrishna T., author.
- Girgis, Morris, author.
- Series:
- NASA technical memorandum ; 2002-211688.
- NASA/TM ; 2002-211688
- Language:
- English
- Subjects (All):
- Ceramics.
- Thermal stresses.
- Thermal conductivity.
- Thermal Conductivity.
- ceramic ware (visual works).
- thermal stress.
- thermal conductivity.
- ceramic (material).
- Medical Subjects:
- Thermal Conductivity.
- Ceramics.
- Physical Description:
- 1 online resource (9 pages) : color illustrations
- Place of Publication:
- Cleveland, Ohio : National Aeronautics and Space Administration, Glenn Research Center, November 2002.
- Notes:
- Title from title screen (viewed Sept. 29, 2015).
- "November 2002."
- "Prepared for the 26th Annual International Conference on Advanced Ceramics and Composites sponsored by the American Ceramic Society, Cocoa Beach, Florida, January 13-18, 2002."
- Includes bibliographical references (page 5).
- Other Format:
- Print version: Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate ... nasa/tm--2002/211688
- Microfiche versiom: Abdul-Aziz, Ali. Influence of cooling hole geometry and material conductivity on the thermal response of cooled silicon nitride plate
- OCLC:
- 922538818
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.