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In the matter of certain semiconductor chips with minimized chip package size and products containing same (III) : investigation no. 337-TA-630.
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- Book
- Government document
- Author/Creator:
- United States International Trade Commission
- Series:
- USITC publication ; 4209.
- Publication ; 4209
- Language:
- English
- Subjects (All):
- Semiconductor industry--United States.
- Semiconductor industry.
- Patent infringement.
- United States--Commercial policy.
- United States.
- Commercial policy.
- Physical Description:
- 1 online resource ([249] pages).
- Other Title:
- Certain semiconductor chips with minimized chip package size and products containing same (III)
- Place of Publication:
- Washington, DC : U.S. International Trade Commission, [2010]
- Notes:
- Title from title screen (viewed on July 2, 2012).
- "December 2010."
- Includes bibliographical references.
- Other Format:
- Print version: United States International Trade Commission. In the matter of certain semiconductor chips with minimized chip package size and products containing same (III)
- OCLC:
- 798255545
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