2 options
Stress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements / by John S. Przybyszewski.
- Format:
- Book
- Government document
- Author/Creator:
- Przybyszewski, John S., author.
- Series:
- NASA technical note ; D-4743.
- NASA technical note ; TN D-4743
- Language:
- English
- Subjects (All):
- Stress-strain curves.
- Cold welding.
- cold-welding.
- Physical Description:
- 1 online resource (ii, 20 pages) : illustrations.
- Place of Publication:
- Washington, D.C. : National Aeronautics and Space Administration, August 1968.
- Notes:
- "August 1968."
- Includes bibliographical references (pages 19-20).
- Description based on online resource, PDF version; title from title page (NASA, viewed on Nov. 27, 2020).
- Electronic reproduction. [Place of publication not identified]: HathiTrust Digital Library. 2025.
- Other Format:
- Print version: Przybyszewski, John S. Stress-strain behavior of cold-welded copper-copper microjunctions in vacuum as determined from electrical resistance measurements.
- OCLC:
- 761214156
- Access Restriction:
- Use copy Restrictions unspecified
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.