2 options
Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 / Kevin Bennion, Gilbert Moreno.
Connect to full text Available online
View online- Format:
- Book
- Government document
- Author/Creator:
- Bennion, Kevin
- Series:
- NREL/PR ; 540-48147.
- NREL/PR ; 540-48147
- Language:
- English
- Subjects (All):
- Power semiconductors--Cooling.
- Power semiconductors.
- Power semiconductors--Packaging.
- Physical Description:
- 1 online resource (26 pages) : color illustrations.
- Place of Publication:
- Golden, Colo. : National Renewable Energy Laboratory, [2009]
- Notes:
- Title from PDF title screen (viewed on July 26, 2010).
- OCLC:
- 650248448
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