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Full field birefringence measurement of grown-in stresses in thin silicon sheet : final technical report 2 January 2002-15 January 2008 / S. Danyluk, S. Ostapenko.

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Format:
Book
Government document
Author/Creator:
Danyluk, Steven S.
Contributor:
Ostapenko, S.
National Renewable Energy Laboratory (U.S.)
Series:
NREL/SR ; 520-44237.
Subcontract report ; NREL/SR-520-44237
Language:
English
Subjects (All):
Photovoltaic cells--Research.
Photovoltaic cells.
Solar cells--Design and construction.
Solar cells.
Physical Description:
1 online resource (23 pages)
Place of Publication:
Golden, Colo. : National Renewable Energy Laboratory, [2008]
Summary:
The primary concern of this research was to develop fundamental knowledge about residual stresses and microcracks and defects in silicon sheet. During the work, two groups developed new experimental techniques to obtain shear stresses and microcracks in sheet silicon. One technique involves infrared photoelasticity, which measures the residual stress-induced birefringence. The residual stresses are related to the birefringence through the stress-optic coefficient described in this report. Anisotropy, thickness, and microstructure are some of the key parameters that affect birefringence, and these topics were investigated as they relate to in-plane residual stresses. In the experimental system developed at Georgia Tech, the anisotropy thickness and microstructure were accounted for by using a four-point bending technique, and were ultimately used to determine the principal stresses in silicon wafers. The work at the University of South Florida focused on using acoustic techniques (resonance ultrasonic vibrations) to determine the existence of microcracks - usually edge cracks - in thin silicon wafers.
Notes:
Title from title screen (viewed on March 19, 2009).
"November 2008."
Other Format:
Danyluk, Steven S. Full field birefringence measurement of grown-in stresses in thin silicon sheet
OCLC:
316339870
Publisher Number:
941480 OSTI ID
Access Restriction:
Publicly released

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