Flip chip hybridization using indium bump technology at ARL / Kimberley A. Olver.

Format:

Book

Government document

Author/Creator:

Olver, Kimberley A., author.

Contributor:

U.S. Army Research Laboratory, issuing body.

Language:

English

Subjects (All):

Microelectronics.

Integrated circuits--Welding.

Integrated circuits.

Miniaturization.

microelectronics.

Medical Subjects:

Miniaturization.

Physical Description:

1 online resource (iv, 8 pages) : color illustrations

Distribution:

[Fort Belvoir, VA] : Defense Technical Information Center.

Other Title:

Flip chip hybridization using indium bump technology at Army Research Laboratory

Place of Publication:

Adelphi. MD : Army Research Laboratory, [2007]

Summary:

Flip chip hybridization bonding is a microelectronics packaging technique which directly connects an active device to a substrate face down, eliminating the need for peripheral wirebonds. Solder material is used as the conductive link between the two parts. Soldier bumps are directly deposited onto the active regions of the device and substrate. The main type of solder bump used at the Army Research Laboratory is the indium solder bump. Indium bump technology has been a part of the electronic interconnect process field for many years. This report discusses the techniques of flip chip hybrid bonding using indium bumps.

Notes:

Title from title screen (viewed on August 4, 2015).

"July 2007."

"ARL-TN-283."

The original document contains color images.

Includes bibliographical references (page 5).

OCLC:

227941243