Thermomechanical simulation methodologies for advanced semiconductor packaging / Shuye Zhang and Guoli Sun.

Format:

Book

Author/Creator:

Zhang, Shuye (Associate professor), author.

Sun, Guoli, author.

Contributor:

Institution of Engineering and Technology, issuing body.

Series:

Materials, circuits and devices series ; 85.

IET materials, circuits and devices series ; 85

Language:

English

Subjects (All):

Microelectronic packaging.

Physical Description:

1 online resource (xii, 181 pages) : illustrations.

Place of Publication:

London, United Kingdom : Institution of Engineering & Technology, 2025.

Summary:

Entering the post-Moore era, electronic packaging technology has played an increasingly important role in enabling the production of more powerful chips, but such technology faces significant thermomechanical challenges. It's important to be able understand and predict the thermomechanical reliability of advanced electronic packaging. Traditional trial-and-error approaches are time-consuming, expensive, and often unable to capture the intricacies of real-world operating conditions. Numerical simulation technology, particularly finite element analysis (FEA), can enable precise simulation and analysis of the multi-physics issues in electronic packaging, thereby assisting researchers in electronic packaging product design and reliability assessment. There is a growing demand for more accurate and efficient simulation techniques to address the thermomechanical challenges faced in advanced electronic packaging. This book compiles the latest advancements in thermomechanical simulation methodologies, empowering researchers and engineers with the knowledge and tools necessary to optimize electronic package designs, predict reliability, and accelerate the development process. This book showcases various failure types and modes for advanced electronic packaging, in assembly, manufacturing and testing. Each chapter incorporates practical case studies, highlighting real-world applications of simulation methodologies to address complex challenges in electronic packaging. Topics covered include numerical simulation methods for warpage evolution, solder joint fatigue, vibration, and drop impact. This concise reference on recent developments in the field offer useful insights for researchers and engineers working on electronic packaging and its reliability.

Contents:

Intro

Contents

Preface

Acknowledgments

About the authors

1. Advanced semiconductor electronic packaging

2. Warpage evolution of TSV wafer based on a hierarchy multiscale analysis method

3. Investigation on fatigue life of solder joints for 2.5D packaging structures

4. Molding process simulation of substrates

5. Structural integration simulation under vibration for PBGA packaging

6. Electromigration simulation study of copper interconnects in 3D packaging

7. Study on the influence of mechanical properties of TSV-Cu on cracking in TSV/RDL interconnect structures

8. Mechanical response of solder joints under drop impact loads

Index

Notes:

Includes bibliographical references and index (pages [177]-181).

Online resource; title from PDF title page (IET, viewed June 6, 2025).

Other Format:

Print version: Zhang, Shuye (Associate professor) Thermomechanical simulation methodologies for advanced semiconductor packaging

ISBN:

9781837241415

1837241414

OCLC:

1525609277

Access Restriction:

Restricted for use by site license.