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ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2024) / American Society of Mechanical Engineers (ASME).
- Format:
- Book
- Author/Creator:
- American Society of Mechanical Engineers (ASME), author, issuing body.
- Language:
- English
- Subjects (All):
- Electronics--Congresses.
- Electronics.
- Photonics--Congresses.
- Photonics.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Publication:
- New York : American Society of Mechanical Engineers (ASME), 2024.
- Notes:
- Description based on publisher supplied metadata and other sources.
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