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2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) / Institute of Electrical and Electronics Engineers (IEEE).
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers (IEEE), author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Thermal properties--Congresses.
- Electronic apparatus and appliances.
- Physical Description:
- 1 online resource : illustrations
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers (IEEE), 2024.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9798350364330
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