Recent Progress in Lead-Free Solder Technology : Materials Development, Processing and Performances / edited by Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli.

Format:

Book

Contributor:

Abdul Aziz, Mohd Sharizal, editor.

Series:

Topics in Mining, Metallurgy and Materials Engineering, 2364-3307

Language:

English

Subjects (All):

Metals.

Metals and Alloys.

Local Subjects:

Metals and Alloys.

Physical Description:

1 online resource (332 pages)

Edition:

1st ed. 2022.

Place of Publication:

Cham : Springer International Publishing : Imprint: Springer, 2022.

Summary:

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Contents:

Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder

Development of Geopolymer Ceramic Reinforced Solder

Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders

Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process

Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics

Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste

Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi

The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental

Flux Modification for Wettability and Reliability Improvement in Solder Joints

Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements

The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth

Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering

Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations

Tin Whiskers Growth in Electronic Assemblies.

Notes:

Includes bibliographical references and index.

Other Format:

Print version: Salleh, Mohd Arif Anuar Mohd Recent Progress in Lead-Free Solder Technology

ISBN:

3-030-93441-1

OCLC:

1302009243