0 options
Wire bonding in microelectronics / George G. Harmon.
- Format:
- Book
- Author/Creator:
- Harman, George G., author.
- Series:
- McGraw-Hill's AccessEngineering
- Language:
- English
- Subjects (All):
- Wire bonding (Electronic packaging)--Production control.
- Wire bonding (Electronic packaging).
- Electronic packaging--Reliability.
- Electronic packaging.
- Electronic packaging--Defects.
- Semiconductors--Failures.
- Semiconductors.
- Genre:
- Electronic books.
- Internet resources.
- Physical Description:
- 1 online resource
- Edition:
- 3rd ed.
- Place of Publication:
- New York : McGraw-Hill, [2010]
- Notes:
- Print version c2010.
- Previous edition: 1997; first published as: Reliability and yield problems of wire bonding in microelectronics. 1989.
- Includes bibliographical references and index.
- Description based on cover image and table of contents, viewed on August 28, 2010.
- Contains:
- The technical introduction to the third edition.
- Ultrasonic bonding systems and technologies, including a description of the ultrasonic wire bonding mechanism.
- Bonding wire metallurgy and characteristics that can affect bonding, reliability, or testing.
- Wire bond testing.
- Gold-aluminum intermetallic compounds and other metallic interface reactions in wire bonding.
- Introduction to plating, section a (gold) and section b (nickel-based) bond pad technology and reliability.
- Cleaning to improve bondability and reliability.
- Mechanical problems in wire bonding.
- Advanced and specialized wire bonding technologies: (including high yield, fine pitch, pcbs, soft substrates, extreme temperature wire bonding and specialized looping).
- An overview of the materials and material science of copper, low-k devices that affect bonding and packaging.
- Wire bonding process modeling and simulation.
- ISBN:
- 9780071476232
- 9780071703345
- Access Restriction:
- Restricted for use by site license.
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.