1 option
Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies / Perry L. Martin.
- Format:
- Book
- Author/Creator:
- Martin, Perry L., author.
- Series:
- McGraw-Hill's AccessEngineering
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Reliability.
- Electronic apparatus and appliances.
- System failures (Engineering).
- Microelectronics.
- Semiconductors.
- Acoustic imaging.
- Infrared photography.
- Electron microscopy.
- X-ray microscopy.
- Metallography.
- Semiconductors--Defects.
- Solder and soldering.
- Printed circuits.
- Electronic apparatus and appliances--Defects.
- Electronics--Materials--Defects.
- Electronics.
- Genre:
- Electronic books.
- Physical Description:
- 1 online resource
- Edition:
- First edition.
- Place of Publication:
- New York, N.Y. : McGraw-Hill Education, [2000]
- Language Note:
- In English.
- Summary:
- "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--Jacket.
- Contents:
- Pt. 1. Introduction to electronic failure analysis
- part 2. Electronic failiure analysis techniques
- part 3. Electronic failure analysis for specific technologies.
- Ch. 1. Overview of electronic component reliability
- chapter 2. Overview of electronic systems reliability
- chapter 3. Product liability
- chapter 4. Photography and optical microscopy
- chapter 5. X-ray/radiographic component inspection
- chapter 6. Infrared thermography
- chapter 7. Acoustic micro imaging failure analysis of electronic devices
- chapter 8. Metallography
- chapter 9. Chemical characterization
- chapter 10. Electronic and electrical characterization
- chapter 11. Scanning electron microscopy and x-ray analysis
- chapter 12. Miscellaneous techniques
- chapter 13. Solder joints
- chapter 14. Failure analysis of printed wiring assemblies
- chapter 15. Wires and cables
- chapter 16. Switches and relays
- chapter 17. Connection technology
- chapter 18. Failure analysis of components
- chapter 19. Semiconductors
- chapter 20. Power and high-voltage considerations.
- Notes:
- Print version c1999.
- Includes bibliographical references and index.
- Electronic reproduction. New York, N.Y. : McGraw Hill, 2000. Mode of access: World Wide Web. System requirements: Web browser. Access may be restricted to users at subscribing institutions.
- Description based on cover image and table of contents, viewed on April 23, 2007.
- Contains:
- Introduction to electronic failure analysis.
- Overview of electronic systems reliability.
- Product liability.
- Photography and optical microscopy.
- X-ray/radiographic component inspection.
- Infrared thermography.
- Acoustic micro imaging failure analysis of electronic devices.
- Metallography.
- Chemical characterization.
- Electronic and electrical characterization.
- Scanning electron microscopy and x-ray analysis.
- Miscellaneous techniques.
- Solder joints.
- Failure analysis of printed wiring assemblies.
- Wires and cables.
- Switches and relays.
- Connection technology.
- Semiconductors.
- Power and high-voltage considerations.
- Other Format:
- Print version: Electronic failure analysis handbook : techniques and applications for electronic and electrical packages, components, and assemblies.
- ISBN:
- 0070410445 (print-ISBN)
- 0071449639
- 9780070410442
- OCLC:
- 746484254
- Access Restriction:
- Restricted for use by site license.
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.