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International Symposium on Advanced Materials & Processing (ISAMP 2022) / Hui Lin Ong.
- Format:
- Book
- Author/Creator:
- Ong, Hui Lin, author.
- Language:
- English
- Subjects (All):
- Materials--Congresses.
- Materials.
- Physical Description:
- 1 online resource (130 pages)
- Other Title:
- INTERNATIONAL SYMPOSIUM ON ADVANCED MATERIALS & PROCESSING
- Place of Publication:
- New York : AIP Publishing, 2024.
- Summary:
- The International Symposium of Advanced Materials and Processing (ISAMP 2021) was the first conference organized by the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP) in conjunction with the International Multidisciplinary Conference (IMC 2021). The ISAMP 2021 was held virtually on 13th July 2021, due to the COVID-19 pandemic. The ISAMP 2021 is aimed to bring together the academics and leading researchers from diverse background and area in materials, mechanical & manufacturing and chemical disciplines. This proceeding contents articles that describe the state-of-art of the research fields mainly related to materials science and engineering. Specific research topics like mechanical and manufacturing; recycling materials and processes; chemical science and engineering; advanced conductive materials and devices; and environment and green technology materials are also included.
- Notes:
- Description based on publisher supplied metadata and other sources.
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