Materials for Electronics Security and Assurance / Navid Asadizanjani, Chengjie Xi and Mark Tehranipoor.

Format:

Book

Author/Creator:

Asadizanjani, Navid.

Contributor:

Xi, Chengjie.

Tehranipoor, Mark M.

ScienceDirect (Online service)

Benjamin Franklin Library Fund.

Language:

English

Subjects (All):

Electronics--Materials.

Electronics.

Physical Description:

1 online resource (224 p.)

Place of Publication:

Amsterdam : Elsevier, 2024.

Contents:

Front Cover

Materials for Electronics Security and Assurance

Copyright

Contents

About the authors

Preface

Acknowledgment

1 Material for heterogeneous integration: Challenges and opportunities

1.1 Introduction

1.2 Background

1.2.1 The evolution of semiconductor packaging

1.2.2 Homogeneous integration

1.2.3 Heterogeneous Integration (HI)

1.2.3.1 2.5D packaging

1.2.3.2 3D packaging

1.2.3.3 Interconnection

1.3 Security threats in heterogeneous integration circuits

1.3.1 Threat models

1.3.2 Potential hardware attacks

1.3.2.1 Hardware Trojans

1.3.3 Counterfeit ICs

1.3.4 Material-based hardware attacks

1.4 Post-packaging assurance: Nondestructive physical inspection for HI

1.4.1 Structural characterization

1.4.2 Material characterization

1.5 Postpackaging assurance: Destructive physical inspection for HI

1.6 Prepackaging assurance: MEMS & NEMS

1.7 Discussion & conclusion

References

2 Packaging encapsulant material for hardware assurance

2.1 Introduction

2.2 Background of IC encapsulant

2.2.1 Encapsulant material composition

2.2.2 Encapsulant fabrication process

2.2.3 Packaging material verification process

2.3 Threat models

2.3.1 Security related chemical and mechanical properties of encapsulant

2.3.2 Existing packaging encapsulant characterization for reliability verification

2.3.2.1 Characterization of thermal and mechanical properties

2.3.2.2 Chemical characterization

2.3.2.3 Volumetric characterization

2.4 Encapsulant material characterization for hardware assurance

2.4.1 Requirements specification

2.4.2 Encapsulate material characterization case study

2.4.2.1 IR-based material characterization

2.4.2.2 X-ray for encapsulant characterization

2.4.2.3 THz-TDS for encapsulant characterization

2.4.3 Other physical inspection methods for encapsulant material characterization

2.5 Summary and discussion

3 Packaging encapsulant material characterization for counterfeit IC detection

3.1 Introduction

3.2 Background: Material for counterfeit detection

3.2.1 Material-based counterfeit detection methods

3.2.2 Infrared spectroscopy for counterfeit IC detection

3.2.3 NIR for counterfeit IC detection

3.2.4 MIR for counterfeit IC detection

3.3 Chemometrics

3.3.1 Encapsulant material data preprocessing

3.3.2 Dimensional reduction and feature selection

3.3.3 Supervised classification model

3.4 Experiment material and methods

3.4.1 Test samples and data collection

3.4.2 Experimental methods

3.4.3 "Global" counterfeit IC detection results

3.4.4 "Individual" counterfeit IC detection results

3.5 Conclusion and future work

4 THz for semiconductor assurance

4.1 Introduction

4.2 THz physical inspection

4.2.1 THz system description

4.2.2 Hardware system setup

4.3 THz signal and detector hardware

Notes:

Description based upon print version of record.

4.3.1 THz source

Electronic reproduction. Amsterdam Available via World Wide Web.

Local Notes:

Acquired for the Penn Libraries with assistance from the Benjamin Franklin Library Fund.

Other Format:

Print version: Asadizanjani, Navid Materials for Electronics Security and Assurance

ISBN:

9780443185434

0443185433

Publisher Number:

99996028348

Access Restriction:

Restricted for use by site license.