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Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA
- Format:
- Book
- Conference/Event
- Conference Name:
- International Mechanical Engineering Congress and Exposition (2005 : Orlando, Fla.)
- Series:
- EPP Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005
- Language:
- English
- Subjects (All):
- Electronic packaging--Wafer-scale integration--Congresses.
- Electronic packaging.
- Photonics--Congresses.
- Photonics.
- Nanotechnology--Congresses.
- Nanotechnology.
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Surface mount technology--Congresses.
- Surface mount technology.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Integrated circuits--Congresses.
- Integrated circuits.
- Place of Publication:
- [Place of publication not identified] ASME 2005
- Language Note:
- English
- Notes:
- Bibliographic Level Mode of Issuance: Monograph
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