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ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2022) - ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and / American Society of Mechanical Engineers.
- Format:
- Book
- Author/Creator:
- American Society of Mechanical Engineers, issuing body.
- Language:
- English
- Subjects (All):
- Electronic systems.
- Physical Description:
- 1 online resource (18 pages)
- Other Title:
- ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Publication:
- New York, N.Y. : American Society of Mechanical Engineers, 2022.
- Summary:
- The front matter for this proceedings is available by clicking on the PDF icon.
- Notes:
- Description based on publisher supplied metadata and other sources.
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