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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems / American Society of Mechanical Engineers.
- Format:
- Book
- Author/Creator:
- American Society of Mechanical Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems
- Place of Publication:
- New York, N.Y. : ASME, 2017.
- Contents:
- Heterogeneous integration: micro-systems with diverse functionality; Servers of the future; Structural and physical health monitoring; Energy conversion and storage; Transportation: autonomous and electric vehicles.
- Notes:
- Description based on publisher supplied metadata and other sources.
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