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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems / ASME.
- Format:
- Book
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource
- Other Title:
- ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Publication:
- New York, N.Y. : ASME, 2018.
- Contents:
- Heterogeneous integration: micro-systems with diverse functionality
- Servers of the future, IoT, and edge to cloud
- Structural and physical health monitoring
- Power electronics, energy conversion and storage
- Autonomous, hybrid, and electric vehicles.
- Notes:
- Description based on publisher supplied metadata and other sources.
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