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ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Volume 1, Advanced packaging; Emerging technologies; Modeling and simulation; Multi-physics based reliability; MEMS and NEMS; Materials and processes : July 16-18, 2013, Burlingame, California, USA / conference sponsor, Electronic and Photonic Packaging Division.
- Format:
- Book
- Conference/Event
- Conference Name:
- ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, Calif.)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (315 pages)
- Other Title:
- Some providers have title as : American Society of Mechanical Engineers 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
- Place of Publication:
- New York : American Society of Mechanical Engineers, 2013.
- Notes:
- Description based on: online resource; title from cover (ASME, viewed February 24, 2020).
- ISBN:
- 9780791855751 (e-book)
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