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Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices

ASME Digital Collection eBooks Available online

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Format:
Book
Author/Creator:
Yeh, L.-T, Author.
Yeh, L.-T., Author.
Contributor:
Chu, R. C, Contributor.
Series:
ASME Press book series on electronic packaging.
ASME Press book series on electronic packaging Thermal management of microelectronic equipment
Language:
English
Subjects (All):
Electronic apparatus and appliances--Cooling.
Electronic apparatus and appliances.
Microelectronics--Thermal properties.
Microelectronics.
Electronic apparatus and appliances--Transmission.
Heat--Protection.
Heat.
Semiconductors.
Physical Description:
1 online resource (440 p.)
Place of Publication:
[Place of publication not identified] ASME Press 2002
Language Note:
English
Notes:
Bibliographic Level Mode of Issuance: Monograph
Includes index.
ISBN:
0-7918-0168-3

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