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Advances in Abrasive Technology XVI : selected, peer reviewed papers from the 16th International Symposium on Advances in Abrasive Technology (ISAAT 2013) in conjunction with the 17th Chinese Conference on Abrasive Technology (CCAT 2013), September 23-26, 2013, Hangzhou, China / edited by Julong Yuan [and four others].
- Format:
- Book
- Conference/Event
- Conference Name:
- International Symposium on Advances in Abrasive Technology (16th : 2013 : Hangzhou, China)
- Chinese Conference of Abrasive Technology (17th : 2013 : Hangzhou, China)
- Series:
- Advanced Materials Research
- Advanced materials research ; 797
- Advanced Materials Research ; v.797
- Language:
- English
- Subjects (All):
- Abrasives--Congresses.
- Abrasives.
- Grinding and polishing--Congresses.
- Grinding and polishing.
- Physical Description:
- 1 online resource (759 p.)
- Edition:
- 1st ed.
- Place of Publication:
- Durnten-Zurich : Trans Tech Publications, [2013]
- Language Note:
- English
- Summary:
- Selected, peer reviewed papers from the 16th International Symposium on Advances in Abrasive Technology (ISAAT 2013), in conjunction with the 17th Chinese Conference of Abrasive Technology (CCAT 2013), September 23-26, 2013, Hangzhou, China.
- Contents:
- Intro
- Advances in Abrasive Technology XVI
- Preface, Sponsors and Committee
- Table of Contents
- Chapter 1: Abrasive Jet Machining
- Optimization of Hybrid Laser-Waterjet Micromachining of Silicon
- A Visualization Study of the Radial-Mode Abrasive Waterjet Turning Process for Alumina Ceramics
- An Experimental Research on Abrasive Water Jet Polishing of the Hard Brittle Ceramics
- Study on the Effect of Standoff Distance on Processing Performance of Alumina Ceramics in Two Modes of Abrasive Waterjet Turning Patterns
- An Experimental Study on Radial-Mode Abrasive Waterjet Turning of Alumina Ceramics
- Kerf Profile Characteristics in Abrasive Air Jet Micromachining
- A Study on Erosion Performance of Monocrystalline Silicon in Ultrasonic Vibration-Assisted Abrasive Water Jet Machining
- Impact Erosion of Quartz Crystals by Micro-Particles in Abrasive Waterjet Micro-Machining
- Chapter 2: Abrasive Machining
- Optimization Design for Gun-Receiver Materials Belt Grinding Based on Orthogonal Experimental Method and Grey Relational Analysis
- Research on Cutter-Contact Point Data Calculation of Robotic Abrasive Belt Polishing for Gun-Receiver Surface
- Research on the Technology of Nc Abrasive Belt Grinding for the Leading and Trailing Edges of Aero-Engine Blades
- Feasibility Study on Grinding of Titanium Alloys with Electroplated CBN Wheels
- Research of Micro-Abrasive Suspension Jet Erosion Morphology and Material Removal Mechanism
- Machining Characteristics of Multilayered Thin Film Solar Panels in Diamond Wire Sawing and Grinding
- Influence of a Grinding Atmosphere in the Combination Grinding of Steel and WC with a Diamond Wheel
- Experimental Investigation of Material Removal Mechanism in Grinding of Alumina by Single Grain Scratch Test.
- Compensation and Experiment Research of Machining Error for Optical Aspheric Precision Grinding
- Dynamics Modeling of Cavitation Bubble in the Grinding Area of Power Ultrasonic Honing
- Experimental Studies on Forces and Specific Energy in High Speed Grinding of Titanium Alloy Ti6Al4V
- Study on the Effect of Coarse Grinding Area Slope Angle on Surface Quality in Point Grinding
- Grinding Force Model for Low-Speed Grinding Based on Impact Principle
- Ultraprecision Lapping for the Zirconia Ceramic Plane
- Experimental Study on the Ultra-Precision Polishing for the Quartz Substrates
- High-Accuracy Calibration of the Wheel Spindle Tilt Angle for Grinding Hydrostatic Seal Rings Used in Reactor Coolant Pumps
- Chapter 3: Advanced Cutting Technology
- Experimental Study on the Thread Turning Performance of Two TiAlN Coated Thread Inserts with Different Features
- Experimental Investigation on Drilling Force and Hole Quality when Drilling of T800S/250F CFRP Laminate
- FEM Analyzing Effect of Tool Body Materials on Security Reliability for Face-Milling Cutter
- Effects of Cutting Conditions on the Machinability of Stainless Steel Formed by Laser Cladding
- Microstructure and Mechanical Properties of Al2O3-TaCw Ceramic Cutting Tool Materials
- An Indicative End-Milling Condition Decision Support System Using Data-Mining for Difficult-to-Cut Materials Based on Comparison with Irregular Pitch and Lead End-Mill and General Purpose End-Mill
- Cutting Edge Preparation of PCBN Inserts
- Comparison of Material Removal Characteristics in Single and Multiple Cutting Edge Scratches
- Effect of Fiber Directions on the Surface Quality of Milling C/SiC Composites
- Numerical Investigation on Effect of Rounded Cutting Edge Radius in Milling of Ultra-High-Strength Steel 30Cr3SiNiMoVA.
- Experimental Investigation on the Cutting Mechanism of Oxygen Free Copper in Cutting Speeds Ranging from 1 m/s to 210 m/s
- Experimental Study on Fractal Laws of Cutting Force for Machining Irregular Surface of Granite
- Chapter 4: Brittle Material Machining
- Experimental Investigations of Grinding Forces in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire
- Study on Numerical Simulation and Experimental of Cutting Force in Turning Machinable Glasses Ceramics
- Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel
- Development of High-Efficiency and Crack-Free Grinding Process for Chamfering of LCD Glass Edge
- Predicted Model of Cutting Force for Single Diamond Fast Milling Hard-Brittle Materials
- Study on Thermal Influence of Grinding Process on LiTaO3
- Chapter 5: CMP and Silicon Wafer Processing
- Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive
- Optimization of Process Parameters Based on Multi-Process and Multi-Evaluation Index for Function Ceramics in CMP
- Investigation of Surface Roughness for Grinding Silicon Wafer of the Micro Pellet Diamond Tool
- Investigation of Dressing Characteristics of Single Crystal Diamond in CMP
- Study of Cluster Magnetorheological-Chemical Mechanical Polishing Technology for the Atomic Scale Ultra-Smooth Surface Planarization of SiC
- Chapter 6: Coolants and Cooling
- Development of an Innovative Water Machining System Employing the Electric Rust Preventive Method - Precise Evaluation of Purity of the Refined Water with a Laser Turbidity Meter
- A Model of the Fluid Convective Cooling in Grinding Process
- Chapter 7: Design, Fabrication and Analysis of Devices for the Applications of Abrasive Technologies.
- Development of Non-Destructive Inspection System for Grinding Burn - An Application of the Grinding Burn Detecting Technique to Evaluate Residual Stress
- Chapter 8: EDM, Ultrasonic Machining, and Laser Machining
- Research on the Ultrasonic Assisted WEDM of Ti-6Al-4V
- Study on Ultrasonic Generator for Ultrasonically Assisted Machining
- Surface Textures Fabrication on Zirconia Ceramics by 3D Ultrasonic Vibration Assisted Slant Feed Grinding
- Effect of Ultrasonic Vibration Parameters on Machining Performance Based on Tool-Workpiece Contact Ratio
- Surface Quality of Textured Surface on Cylindrical Inner Surface Using Whirling Electrical Discharge Texturing
- Fundamental Machining Characteristics of Ultrasonic Assisted Turning of Titanium Alloy Ti-6Al-4V
- Effectiveness of Ultrasonic Vibration on Press Forming
- A Study on Ultrasonic Assisted Grinding of Nickel-Based Superalloys
- Effect of Ultrasonic EDM on Machinability of Coarse PCD
- Micro-Grooving of Glass Using Small-Diameter Diamond Grindstone with Ultrasonic Vibration
- A Study on Grinding Tungsten Carbide with Ultrasonic Assisted
- Chapter 9: Finishing, Lapping and Polishing
- Research on Ultra Precision Mirror Machining Technology for Aluminum Alloy Mobile Phone Shell
- Research on Process Parameters Influencing on Cutting Force in Abrasive Flow Machining (AFM)
- Effects of Magnetic Fluid on Machining Characteristics in Magnetic Field Assisted Polishing Process
- Effects of Permanent Magnet Excitation on Material Removal Rate in Area Taking Magnetorhelogical Finishing
- Research on Grain Impacting Load in Abrasive Flow Machining
- Study of Process Characteristics of Abrasive Flow Machining (AFM) for Ti-6Al-4V and Validation with Process Model
- Study on the Characteristics of New Abrasive Medium for Abrasive Flow Machining.
- Experimental Study on Micro-Deliquescence Ultra-Precision Polishing with Fine Water Mist for KDP Crystal
- Research on Distribution of Magnetic Particles Based on Magnetic Field Control Grinding Wheel
- Experimental Research on Rolling Bearing Raceway Finishing
- A Study on the Analysis of Influential Factors for 300mm Wafer Final Polishing
- Study on Dual-Plane Ball Polishing Method for Finishing Ceramics Ball
- Polishing Characteristics of a Low Frequency Vibration Assisted Polishing Method
- Polishing Technology and Phenomena of the Inner/Outer Surfaces of Small Cup-Type Nickel Tube-Study of Ultraviolet-Ray Aided Machining
- Friction Force Analysis on Diaomond Lapping of Sapphire Wafers
- Study on Impinging Stream Flow Channel in Abrasive Flow Polishing Complex Cavity of Precision Mold
- Proposal of Finishing Method of MLA Mold Applied Sphere Indentation
- Chapter 10: Glass Molding and Related Topics
- Experiment on Glass Microgroove Molding by Using Polycrystalline Nickel Phosphorus Mold
- Chapter 11: Grinding Wheel and Abrasive Grain Technologies
- Experimental Study on a New Combination Processing Technology of Polycrystalline Diamond
- CVD Micron Diamond Powders
- Study on Radial Deformation of CBN Grinding Wheel Considering Centrifugal Force and Grinding Heat
- Progress of Researches on the Surface Topography Detection Techniques for Grinding Wheel
- Creep Feed Grinding of Ni-Based Superalloy with Micro-Crystalline Ceramic Alumina Wheels
- Grinding Characteristics of Porous Composite-Bonded CBN Wheels
- Effect of Contact Stiffness of Grinding Wheel on Ground Surface Roughness and Residual Stock Removal of Workpiece
- Analysis on Wear of Self-Sharpening Fine Super-Hard Abrasive Tool
- Heat Pipe Grinding Wheel in Grinding Titanium Alloy Ti-6Al-4V
- Chapter 12: In-Process Measurement and Monitoring, Metrology.
- Development of CMM Auxiliary Equipment for Tiny Hole Measuring.
- Notes:
- "ISAAT 2010 at the Howard International House, Taipei, Taiwan, is the 13th of a series of ISAAT"--Preface.
- Includes bibliographical references and index.
- Description based on online resource; title from PDF title page (ebrary, viewed December 9, 2013).
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9783038262060
- 3038262064
- OCLC:
- 870305827
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