Ultra-precision machining technologies : selected, peer reviewed papers from the 8th CHINA-JAPAN International Conference on Ultra-Precision Machining, (CJUMP2011), November 20-22, 2011, Hangzhou, P.R. China / edited by Julong Yuan, Hitoshi Ohmori and Binghai Lv.

Format:

Book

Conference/Event

Author/Creator:

China-Japan International Conference on Ultra-Precision Machining, Corporate Author.

Contributor:

Yuan, Julong.

Ohmori, Hitoshi.

Lv, Binghai.

Conference Name:

China-Japan International Conference on Ultra-Precision Machining (8th : 2011 : Hangzhou, China), issuing body.

China-Japan International Conference on Ultra-Precision Machining

Series:

Advanced materials research ; v. 497.

Advanced materials research, 1022-6680 ; volume 497

Language:

English

Subjects (All):

Machining--Congresses.

Machining.

Tolerance (Engineering)--Congresses.

Tolerance (Engineering).

Physical Description:

1 online resource (415 p.)

Place of Publication:

Durnten-Zurich, Switzerland : Trans Tech Publications, [2012]

Language Note:

English

Summary:

The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in th

Contents:

Ultra-Precision Machining Technologies, CJUMP2011; Preface, Committees and Sponsors; Table of Contents; Experiment and Discussion on Ultrasonic Vibration-Assisted Single Point Diamond Turning of Die Steels; A Novel Orderly Arrangement Method Controlled by Magnetic Field for Diamond Abrasives of Grinding Wheel; Influence of Cup Wheel Grinding and Etching Pretreatment on Residual Stress and Surface Topography for Coated Cemented Carbide Tools; Precision Grinding of Structured Tungsten Carbide Mold; Analysis on Kinematic Characteristics of Precision Balls Grinding

Study on Machining Characteristics of Sawing Al2O3 Ceramic with Diamond Cut-Off WheelWear Mechanism of High-Speed Turning Ti-6Al-4V with TiAlN and AlTiN Coated Tools in Dry and MQL Conditions; Study on Fracture Performance of In Situ Growth Whisker Toughened Composite Ceramic Tool; The Performances of Different Coated Carbide Drills when Drilling a Cast Nickel-Based Alloy; New Approach for Noncircular Following Grinding of Crankshaft Pin; Study on the Process of Gear Shaft Formed by Cross Wedge Rolling Based on Deform

Research on the Surface Roughness Predictive Model of Austempered Ductile Iron Based on Genetic AlgorithmStudy on Dynamic Stiffness of Machine Tool with Consideration of Friction Damping in Guide; Fabrication and Cutting Performance of CVD Diamond Coated Inserts with Different Coating Thickness in Dry Turning Aluminum Alloy; Influence of Diameter and Number of Orifice on Static Characteristics of Radial-Thrust Aerostatic Bearing; Research on High Performance Vitrified Bond Diamond Wheel; Optimum Design for the Frame of Open Type Abrasive Flow Polish Machine

Cutting Performance and Failure Mechanisms of Coated Carbide Tools in Face Milling Powder Metallurgy Nickel-Based SuperalloyStudy on Dynamic Characteristics of a Hydrostatic and Hydrodynamic Journal Bearings for Small Diameter Grinding Spindle; Current Research Trends on Resin Bond Used for Abrasive Products; Influence of Soluble Filler on the Mechanical Properties of Porous Self-Generation Superabrasive Tool; Research on Soil Vibratory Cutting with ALE Finite Element Simulation Method; Transient Heat Transfer Simulation in Rapid Heat Cycle Molding with Electric Heating

Tool Breakage Feature Extraction in PCB Micro-Hole Drilling Using Vibration SignalsEffects of Process Parameters on Surface Gloss in Rapid Heat Cycle Molding Process; New Measurement Concept of Nanometer-Level Defects on Si Wafer Surface by Using Micro Contact Sensor; Absolutely Testing of Off-Axis Aspherical Mirror Using Dichotomy Computer-Generated Holograms; Dual-Servo Mechanism of STM for Measurement of Sub Millimeter Deep Trench Structures; The Acoustic Micro Integrated Detection Technique for Silicon Wafer Processing

XTEM Observation of 4H-SiC (0001) Surfaces Processed by Plasma Assisted Polishing

Notes:

" ... CHINA-JAPAN Conference on Ultra-Precision Machining (CJUPM) ..." -- preface.

International conference proceedings.

Includes bibliographical references and index.

Description based on print version record.

ISBN:

9783038138143

3038138142