Reflow soldering processes and troubleshooting : SMT, BGA, CSP and Flip Chip technologies / Ning-Cheng Lee.

Format:

Book

Author/Creator:

Lee, Ning-Cheng, author.

Language:

English

Subjects (All):

Solder and soldering.

Electronic packaging.

Electronic apparatus and appliances--Design and construction.

Electronic apparatus and appliances.

Physical Description:

1 online resource (281 p.)

Place of Publication:

Boston : Newnes, [2002]

Language Note:

English

Summary:

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practica

Contents:

Cover; Copyright Page; Contents; Preface; Chapter 1. Introduction to Surface Mount Technology; 1.1 Surface mount technology; 1.2 Surface mount technology trends; 1.3 Conclusion; References; Chapter 2. Fundamentals of Solders and Soldering; 2.1 Soldering theory; 2.2 Effect of elemental constituents on wetting; 2.3 Phase diagram and soldering; 2.4 Microstructure and soldering; 2.5 Conclusion; References; Appendix 2.1 Effect of flux surface tension on the spread of molten solder; Chapter 3. Solder Paste Technology; 3.1 Fluxing reactions; 3.2 Flux chemistry; 3.3 Solder powder

3.4 Solder paste composition and manufacturing3.5 Solder paste rheology; 3.6 Solder paste rheology requirement; 3.7 Conclusion; References; Chapter 4. Surface Mount Assembly Processes; 4.1 Solder paste materials; 4.2 Printer level consideration; 4.3 Pick-and-place; 4.4 Reflow; 4.5 Effect of reflow atmosphere on soldering; 4.6 Special soldering considerations; 4.7 Solder joint inspection; 4.8 Cleaning; 4.9 In-circuit-testing; 4.10 Principle of troubleshooting reflow soldering; 4.11 Conclusion; References; Chapter 5. SMT Problems Prior to Reflow; 5.1 Flux separation; 5.2 Crusting

5.3 Paste hardening5.4 Poor stencil life; 5.5 Poor paste release from squeegee; 5.6 Poor print thickness; 5.7 Smear; 5.8 Insufficiency; 5.9 Needle clogging; 5.10 Slump; 5.11 Low tack; 5.12 Short tack time; 5.13 Conclusion; References; Chapter 6. SMT Problems During Reflow; 6.1 Cold joints; 6.2 Nonwetting; 6.3 Dewetting; 6.4 Leaching; 6.5 Intermetallics; 6.6 Tombstoning; 6.7 Skewing; 6.8 Wicking; 6.9 Bridging; 6.10 Voiding; 6.11 Opening; 6.12 Solder balling; 6.13 Solder beading; 6.14 Spattering; 6.15 Conclusion; References; Chapter 7. SMT Problems at the Post-reflow Stage; 7.1 White residue

7.2 Charred residue7.3 Poor probing contact; 7.4 Surface insulation resistance or electrochemical migration failure; 7.5 Delamination/voiding/ non-curing of conformal coating/encapsulants; 7.6 Conclusion; References; Chapter 8. Solder Bumping for Area Array Packages; 8.1 Solder criteria; 8.2 Solder bumping and challenges; 8.3 Conclusion; References; Chapter 9. BGA and CSP Assembly and Rework; 9.1 Assembly process; 9.2 Rework; 9.3 Challenges at assembly and rework stages; 9.4 Conclusion; References; Chapter 10. Flip Chip Reflow Attachment; 10.1 Flip chip attachment

10.2 Problems during flip chip reflow attachment10.3 Conclusion; References; Chapter 11. Optimizing a Reflow Profile Via Defect Mechanisms Analysis; 11.1 Flux reaction; 11.2 Peak temperature; 11.3 Cooling stage; 11.4 Heating stage; 11.5 Timing considerations; 11.6 Optimization of profile; 11.7 Comparison with conventional profiles; 11.8 Discussion; 11.9 Implementing linear ramp-up profile; 11.10 Conclusion; References; Chapter 12 Lead-free Soldering; 12.1 Initial activities; 12.2 Recent activities; 12.3 Impact of Japanese activities; 12.4 US reactions; 12.5 What is lead-free interconnect?

12.6 Criteria of lead-free solder

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

Description based on online resource; title from PDF title page (ebrary, viewed March 3, 2017).

ISBN:

9786611006679

9781281006677

128100667X

9780080492247

008049224X

OCLC:

437181630