ISTFA 2007 [electronic resource] : proceedings of the 33rd International Symposium for Testing and Failure Analysis, November 4-8, 2007, San Jose McEnery Convention Center, San Jose, California, USA / sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2007, ASM International.

Format:

Book

Conference/Event

Author/Creator:

ASM International, Corporate Author.

Contributor:

ASM International.

Electronic Device Failure Analysis Society.

Conference Name:

International Symposium for Testing and Failure Analysis (33rd : 2007 : San Jose, Calif.)

Language:

English

Subjects (All):

Electronics--Materials--Testing--Congresses.

Electronics.

Electronic apparatus and appliances--Testing--Congresses.

Electronic apparatus and appliances.

Physical Description:

1 online resource (371 p.)

Other Title:

Proceedings of the 33rd International Symposium for Testing and Failure Analysis

33rd International Symposium for Testing and Failure Analysis

Thirty-third International Symposium for Testing and Failure Analysis

Place of Publication:

Materials Park, OH : ASM International, c2007.

Language Note:

English

Contents:

""Contents""; ""Session 1: Emerging Concepts""; ""Session 2: Circuit Edit 1""; ""Session 3: SPM Techniques""; ""Session 4: Sample Preparation""; ""Session 5: Photon Based Techniques""; ""Session 6: In-Line Metrology and Inspection""; ""Session 7: Package and Assembly Level FA 1""; ""Session 8: Posters""; ""Session 9: Package and Assembly Level FA 2""; ""Session 10: Nanoprobing""; ""Session 11: Package and Assembly Level FA 3""; ""Session 12: Failure Analysis Process 1""; ""Session 13: Yield Enhancement""; ""Session 14: System Level Analysis and Test""; ""Session 15: Circuit Edit 2""

""Session 16: Failure Analysis Process 2""""Author Index""

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

1-61503-090-5

OCLC:

929147596