Surface finishing technology and surface engineering : selected, peer reviewed papers from International Conference on Surface Finishing Technology & Surface Engineering, (ICSFT2008), 20-21 September 2008, Taiyuan, China / edited by Shengqiang Yang, Shichun Yang, Hang Gao.

Format:

Book

Conference/Event

Author/Creator:

International Conference on Surface Finishing Technology & Surface Engineering, Corporate Author.

Contributor:

Yang, Shengqiang.

Yang, Shichun.

Gao, Hang.

Conference Name:

International Conference on Surface Finishing Technology & Surface Engineering, issuing body.

International Conference on Surface Finishing Technology & Surface Engineering

Series:

Advanced materials research ; v. 53-54.

Advanced materials research, 1022-6680 ; volumes 53-54

Language:

English

Subjects (All):

Surfaces (Technology)--Congresses.

Surfaces (Technology).

Finishes and finishing--Congresses.

Finishes and finishing.

Physical Description:

1 online resource (423 p.)

Place of Publication:

Stafa-Zurich ; Enfield, New Hampshire : Trans Tech Publications, [2008]

Language Note:

English

Summary:

Enhancing the surface finish and integrity of engineered components is increasingly important; particularly for the parts used in electronic and optical devices and systems. Significant progress has been made, in recent years, in developing new and advanced surface-finishing technologies as well as acquiring a fundamental understanding of the surface finishing technologies in order to predict, control and optimise surface-finishing processes. The aim of this special volume was to bring together the latest know-how of academic researchers and industrial engineers and present the latest developm

Contents:

Surface Finishing Technology and Surface Engineering; Sponsors and Committees; Preface; Table of Contents; Surface Finishing Technologies and Applications; Compound Finish Processes Using Burnishing and Ultrasonic Electrochemical Finishing on Hole-Wall Surface; Simulation of Flows Field Characteristics in the Nozzle of Two-Phase Compulsive Circulation Flows Finishing; Process Characteristics Research on Horizontal Spindle Barrel Finishing; Modeling and Experiment of Anodic Smoothening in Electrochemical Finishing Based on Lateral Direction Dissolution

Experimental Investigation on Electrochemical Finishing Machining of Stainless Steel in Passive Electrolyte SolutionCompliant Control at Micro-Displacement in Hydrodynamic Suspension Ultra-Smooth Machining; Theoretical Analysis and Experimental Verification of Validity Finished by Abrasive Jet with Grinding Wheel as Restraint; Computer Simulation on Centrifugal Barrel Surface Finishing Based on Discrete Element Method; Mechanism Research on the Swirling Air Flow Compounded with Magnetic-Field Finishing; Material Removal Mechanism in Vibration-Assisted Magnetic Abrasive Finishing

Internal Magnetic Abrasive Particles Surface Finishing Based on Permanent Magnetic FieldII. Deburring Theories and Technologies; Finite Element Modeling of Burr Formation in Orthogonal Metal Cutting; Formation and Simulation of Two-Side Burr in Orthogonal Cutting; Study on Burr Formation in Face Milling of Stainless Steel with Chamfered Cutting Tool ; The Effect of Shear Strain on Transformation between Burr and Negative Burr ; Numerical Study of the Effect of Tool Wear on Burr Formation in Blanking Process; Transformation of Cutting Burr/Fracture in High-Speed Machining Al Alloy

III. Lapping and Polishing Technologies and ApplicationsPolishing of Free-Standing CVD Diamond Films by the Combination of EDM and CMP ; Analyzing on Nonuniformity of Material Removal in Silicon Wafer CMP Based on Abrasive Movement Trajectories; Friction-Based In Situ Endpoint Detection of Copper CMP Process; Research on Mechanism of Chemical Mechanical Polishing Process for Silicon Nitride Balls with CeO2 Abrasive; Polishing Processing to Internal Surface of Non-Magnetic Pipe by Magnetic Abrasive Finishing

Surface Lapping by Semi-Bonded Abrasive Grinding Plate for Copper Substrates of Amorphous Ni-Pd-P Alloy FilmsStudy on the Evaluation Method of Lapping Uniformity for Ceramic Balls; Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect; Experimental Validation of the 'Trap' Effect of the Semibonded Abrasive Grinding Plate ; Effect of Ice Counterparts on the Friction Behavior of Single Crystal Silicon Wafer ; Machining Characteristics of Semibonded Abrasive Grinding Plate

The Analysis for Materials Removal Mechanism of Ultrasonic Auxiliary Gear Honing

Notes:

Description based upon print version of record.

Includes bibliographical references and indexes.

Description based on print version record.

ISBN:

9783038132134

3038132136