Microelectronic failure analysis : desk reference : 2001 supplement / prepared under the direction of the Electronic Device Failure Analysis Society Publications Committee.

Format:

Book

Contributor:

Electronic Device Failure Analysis Society.

Language:

English

Subjects (All):

Electronics--Materials--Testing--Handbooks, manuals, etc.

Electronics.

Microelectronics--Materials--Testing--Handbooks, manuals, etc.

Microelectronics.

Microelectronics--Materials--Defects--Handbooks, manuals, etc.

Electronic apparatus and appliances--Testing--Handbooks, manuals, etc.

Electronic apparatus and appliances.

Semiconductors--Defects--Handbooks, manuals, etc.

Semiconductors.

Physical Description:

1 online resource (161 p.)

Place of Publication:

Materials Park, OH : ASM International, c2001.

Language Note:

English

Summary:

CD-ROM content is in fully searchable Adobe Acrobat PDF format, Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee. Provides new or expanded coverage on important techniques for microelectronic failure analysis. Contents include: Backside isolation techniques; Flip-chip focused ion beam backside navigation; Circuit validation techniques; Copper metallization deprocessing; Tunnelling atomic force microscopy; Scanning capacitance microscopy; Scanning probe microscopy; Packaging and chip cross-sectioning; Glossary of failure analysis tool acronyms; Updated key word index to ISTFA Proceedings volumes and to the Microelectronic Failure Analysis Desk Reference, 4th Edition. (+VAT on UK orders)

Contents:

""Preface""; ""Contents""; ""Focused Ion Beam Backside Isolation Techniques""; ""Package/Sample Cross Sectioning""; ""Copper Deprocessing""; ""Atomic Force Microscopy, Scanning Probe Microscopy, and Scanning Capacitance Microscopy""; ""Supplementary Information""

Notes:

Description based upon print version of record.

Includes bibliographical references and index.

ISBN:

1-61503-265-7

OCLC:

647829197