ISTFA '97 : proceedings of the 23rd International Symposium for Testing and Failure Analysis : 27-31 October, 1997, Santa Clara Convention center, Santa Clara, California / sponsored by ASM International.

Format:

• Book
• Conference/Event

Contributor:

• Davidson, Grace M.
• ASM International.

Conference Name:

• International Symposium for Testing and Failure Analysis (23rd : 1997 : Santa Clara, Calif.)

Language:

English

Subjects (All):

• Electronics--Materials--Testing--Congresses.
• Electronic apparatus and appliances--Testing--Congresses.

Physical Description:

1 online resource (309 p.)

Other Title:

23rd international symposium for testing and failure analysis

Place of Publication:

Materials Park, OH : ASM International, c1997.

Language Note:

English

Summary:

Proceedings of the October 1997 symposium, of interest to engineers involved in testing and failure analysis of semiconductor devices. Contains sections on testing and signature analysis, techniques, micro-electric-mechanical systems, discretes, packaging/E-beam, FIB/E- beam, and case histories. Specific topics include gain reduction in silicon pho

Contents:

• ""Scanning Fluorescent Microthermal Imaging""""Temperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM)""; ""Thermal and Optical Enhancements to Liquid Crystal Hot Spot Detection Methods""; ""Application of Ba~kside Photo and Thermal Emission Microscopy Techniques to Advanced Memory Devices""; ""Cross Sectioning with a Pivoting Sample Block""; ""Gain Reduction in Silicon Phototransistors Induced by Metallization Mask Misalignment""; ""Comparison Precision XTEM Specimen Preparation Techniques for Semiconductor Failure Analysis""
• ""Temperature-Dependent Electronic Circuit Analogy for Predicting Wire Temperature as a Function of Current""""The Application of FIB Voltage-Contrast Technique Combining with TEM on Subtle Defect Analysis: Via Delamination After TC""; ""The Usage of Focused Ion Beam Induced Deposition of Gold Film in Ie Device Modification and Repair""; ""Failure Analysis Challenges of Surface Micromachined Accelerometers""; ""Failure Analysis for Micro-Electrical- Mechanical Systems (MEMS)""
• ""Investigation of Multi- Level Metallization ULSls by Light Emission from the Back- Side and Front- Side of the Chip""""A Simple, Cost Effective, and Very Sensitive Alternative for Photon Emission Spectroscopy""; ""Novel Failure Analysis Technique "" Light Induced State Transition ( LIST)"" Method Using an OBIC System""; ""An Application of Breakthrough Failure Analysis Techniques in Eliminating Silicon Dislocation Problem in Sub-Micron CMOS Devices""; ""Characterization of Californium - 252 ( 2s2Cf) as a Laboratory Source of Radiation for Testing and Analysis of Semiconductor Devices""
• ""Dendritic Growth Failure of a Mesa Diode""""Interpretation of Sudden Failures in Pump Laser Diodes""; ""Through- Transmission Acoustic Inspection of Ball Grid Array ( BGA) Packages""; ""Moisture Detection Method in Ceramic Package by Slight Current Measurement""; ""Laser Microchemical Technology: NewTools for Flip- Chip Debug and Failure Analysis""; ""Single Contact Electron Beam Induced Current Microscopy for Failure Analysis of Integrated Circuits""; ""Electrical and Chemical Characterization of FIB- Deposited Insulators""
• ""Transmission Electron Microscopy (TEM) Specimen Preparation Technique using Focused Ion Beam (FIB): Application to Material Characterization of Chemical Vapor Deposition of Tungsten ( W) and Tungsten Silicides ( WsiJ""

Notes:

• "Manager of Book Production Grace M. Davidson."
• Includes bibliographic references and index.

ISBN:

1-61503-082-4

OCLC:

929147735