ISTFA 2013 : conference proceedings from the 39th International Symposium for Testing and Failure Analysis, November 3-7, 2013, San Jose Convention Center, San Jose, California, USA / sponsored by Electronic Device Failure Analysis Society.

Format:

Book

Conference/Event

Author/Creator:

International Symposium for Testing and Failure Analysis, Corporate Author.

Contributor:

Electronic Device Failure Analysis Society, sponsor.

Conference Name:

International Symposium for Testing and Failure Analysis (39th : 2013 : San Jose, California)

Language:

English

Subjects (All):

Electronics--Materials--Testing--Congresses.

Electronics.

Electronic apparatus and appliances--Testing--Congresses.

Electronic apparatus and appliances.

Physical Description:

1 online resource (633 p.)

Place of Publication:

Materials Park, Ohio : ASM International, 2013.

Language Note:

English

Summary:

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results. Includes papers relating to the analysis of integrated circuits, MEMS, nanodevices, optoelectronics, discrete and passive components, electronic packaging, card level components, and electronic systems in the following areas: New and emerging analytical concepts Diagnostic testing and debug Physical fault isolation (optical, thermal, magnetic, etc.) Electrical characterisation and nanoprobing Scanning probe technology Microscopy (SEM, TEM, light microscopy, etc.) Physical circuit-edit techniques (FIB, laser, etc.) Sample preparation (milling, polishing, etching, grinding, etc.) Chemical and materials analysis (Auger, SIMS, RBS, etc.) Metrology and in-line characterisation and analysis Yield and reliability enhancement Competitive analysis Image processing Analytical thought process Laboratory and environmental safety and green processes Automation Laboratory management and finance Future challenges, especially those relating to the deep nanoscale regime

Contents:

""Title Page""; ""Copyright""; ""Board of Directors""; ""Organizing Committee""; ""Symposium Committee""; ""User Groups""; ""Contents""; ""2013 IPFA Best Paper""; ""Non-Destructive Open Fault Isolation in Flip-Chip Devices with Space-Domain Reflectometry""; ""3D Packages""; ""3D Void Imaging in Through Silicon Vias by X-ray Nanotomography in a SEM""; ""Challenges for Physical Failure Analysis of 3D-Integrated Devices - Sample Preparation and Analysis to Support Process Development of TSVs""; ""Sample Preparation Strategies for Fast and Effective Failure Analysis of 3D Devices""

""Fast and Precise 3D Tomography of TSV by Using Xe Plasma FIB""""Case Studies and the Failure Analysis Process""; ""22 nm BEOL TDDB Defect Localization and Root Cause Analysis""; ""Open Failure Diagnosis Candidate Selection Based on Passive Voltage Contrast Potential and Processing Cost""; ""Effective Defect Localization on Nanoscale Short Failures""; ""Defect Isolation Tools Accelerate the Failure Analysis Process""; ""First in Operando SEM Observation of Electromigration-Induced Voids in TSV Structures""

""The Application of Magnetic Force Microscopy for Detection of Subsurface Anomalies in Semiconductor Device Wiring Levels""""Computed Tomography as Failure Analysis Insurance""; ""Challenges of Small Defect Analysis in Large Analog Power FET Arrays""; ""Conversion of a D-Mode FET to an E-Mode FET via Electrostatic Discharge in a GaAs Power Amplifier Duplexer Module""; ""Marginal RF Gain Investigation and Root Cause Determination""; ""Anamnesis in Failure Analysis - How a System-Related Approach Can Save Failure Analysis (FA) Time, Shorten Learning Loops and Reduce Cost""

""Failure Analysis for SRAM Logic Type Failures""""Circuit Edit ""; ""Circuit Edit Geometric Trends""; ""Implications of Helium and Neon Ion Beam Chemistry for Advanced Circuit Editing""; ""Silicon and Package Preparation Options for Focused Ion Beam (FIB) Circuit Editing and General Packaging Failure Analysis""; ""Defect Characterization and Metrology ""; ""Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication""; ""Surface Microstructure Evolution Upon Silicidation of Ni(Pt) and the Different Responses to Metal Etch""

""Gate Leakage Characterization and Fail Mode Analysis on 20 nm Technology Parametric Test Structures""""STEM EDX Mappings and Tomography for Process Characterization and Physical Failure Analysis of Advanced Devices""; ""Automatic Registering and Stitching of TEM/STEM Image Mosaics""; ""AFM-Based Chemical and Mechanical Property Characterization of Interconnects and Defects""; ""Evaluation of Digital Holography Microscopy for Roughness Control Prior Wafer Direct Bonding""; ""Emerging Concepts and Techniques ""; ""Pump-Probe Imaging of Integrated Circuits""

""Two-Photon-Absorption-Enhanced Laser-Assisted Device Alteration and Single-Event Upsets in 28 nm Silicon Integrated Circuits""

Notes:

Description based upon print version of record.

Includes bibliographical references at the end of each chapters and index.

Description based on online resource; title from PDF title page (ebrary, viewed August 30, 2014).

ISBN:

1-68015-513-X

1-62708-023-6

OCLC:

929147972