Interconnect Reliability in Advanced Memory Device Packaging / by Chong Leong, Gan, Chen-Yu, Huang.

Format:

Book

Author/Creator:

Gan, Chong Leong, author.

Huang, Chen-Yu, author.

Series:

Springer Series in Reliability Engineering, 2196-999X

Language:

English

Subjects (All):

Computers.

Electronic circuits.

Hardware Performance and Reliability.

Electronic Circuits and Systems.

Local Subjects:

Hardware Performance and Reliability.

Electronic Circuits and Systems.

Physical Description:

1 online resource (223 pages)

Edition:

1st ed. 2023.

Place of Publication:

Cham : Springer International Publishing : Imprint: Springer, 2023.

Summary:

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.

Contents:

Chapter 1: Advanced Memory and Device Packaging

Chapter 2: Wearout Reliability-based Characterization in Memory Packaging

Chapter 3: Recycling of Noble Metals Used in Memory Packaging

Chapter 4: Advanced Flip Chip Packaging

Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)

Chapter 6: Specific Packaging Reliability Testing

Chapter 7: Reliability Simulation and Modeling in Memory Packaging

Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.

Other Format:

Print version: Gan, Chong Leong Interconnect Reliability in Advanced Memory Device Packaging

ISBN:

9783031267086

OCLC:

1378389907