Chiplet Design and Heterogeneous Integration Packaging / by John H. Lau.

Format:

Book

Author/Creator:

Lau, John H., author.

Language:

English

Subjects (All):

Electronics.

Electronic circuits.

Microtechnology.

Microelectromechanical systems.

Electronics and Microelectronics, Instrumentation.

Electronic Circuits and Systems.

Microsystems and MEMS.

Local Subjects:

Electronics and Microelectronics, Instrumentation.

Electronic Circuits and Systems.

Microsystems and MEMS.

Physical Description:

1 online resource (542 pages)

Edition:

1st ed. 2023.

Place of Publication:

Singapore : Springer Nature Singapore : Imprint: Springer, 2023.

Summary:

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Contents:

State-of-the-Art of Advanced Packaging

Chip Partition and Chip Split

Multiple System and Heterogeneous Integration with TSV Interposers

Multiple System and Heterogeneous Integration with TSV-Less Interposers

Chiplets Lateral (Horizontal) Communications

Cu-Cu Hybrid Bonding.

Notes:

Includes bibliographical references and index.

Other Format:

Print version: Lau, John H. Chiplet Design and Heterogeneous Integration Packaging

ISBN:

9789811999178

OCLC:

1374431206