More-than-Moore Devices and Integration for Semiconductors / edited by Francesca Iacopi, Francis Balestra.

Format:

Book

Contributor:

Iacopi, F. (Francesca), editor.

Balestra, Francis, editor.

Language:

English

Subjects (All):

Electronic circuits.

Electronics.

Solid state physics.

Electronic Circuits and Systems.

Electronics and Microelectronics, Instrumentation.

Electronic Devices.

Local Subjects:

Electronic Circuits and Systems.

Electronics and Microelectronics, Instrumentation.

Electronic Devices.

Physical Description:

1 online resource (xiv, 260 pages) : illustrations

Edition:

1st ed. 2023.

Place of Publication:

Cham : Springer International Publishing : Imprint: Springer, 2023.

Summary:

This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.

Contents:

Introduction

TSV and interposers

Interconnects, including optical

Simulations and reliability

Sensors and cameras

Integrated power sources

Energy harvesters and power management

Flexible and wearable electronics

Photonics and/ or Antennas with metamaterials

Neuromorphic computing for IoT

Brain-computer interfaces.

Notes:

Includes bibliographical references and index.

Other Format:

Print version: Iacopi, Francesca More-Than-Moore Devices and Integration for Semiconductors

ISBN:

3-031-21610-5