1 option
2023 International Conference on Electronics Packaging (ICEP) / IEEE.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Industrial engineering--Congresses.
- Industrial engineering.
- Physical Description:
- 1 online ressource : illustrations
- Other Title:
- 2023 International Conference on Electronics Packaging
- Place of Publication:
- Piscataway, NJ : IEEE, 2023.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 4-9911911-5-7
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