Failure Analysis : High Technology Devices / Daniel J. D. Sullivan, Eric J. Carleton.

Format:

Book

Author/Creator:

Sullivan, Daniel J. D.

Contributor:

Carleton, Eric J.

Walter de Gruyter & Co.

Series:

De Gruyter STEM

Language:

English

Subjects (All):

Failure analysis (Engineering).

System failures (Engineering).

High technology.

Physical Description:

1 online resource (130 p.).

Place of Publication:

Boston : Walter de Gruyter, [2022]

Contents:

Intro

Contents

Chapter 1 Introduction to FA

Chapter 2 Why is FA important?

Chapter 3 Planning out an FA

Chapter 4 Typical types of failure mechanisms

Chapter 5 Destructive versus nondestructive analysis

Chapter 6 Optical Microscopy (OM)

Chapter 7 Scanning Acoustic Microscopy/Tomography (SAM or SAT)

Chapter 8 X-ray imaging (2D and 3D)

Chapter 9 Time Domain Reflectometry (TDR)

Chapter 10 Selecting the path before destructive analysis begins

Chapter 11 Destructive work

Chapter 12 Electrical Failure Analysis (EFA)

Chapter 13 EMMI/OBIRCH/IR

Chapter 14 Cross sections (X-sections)

Chapter 15 Parallel lapping (p-lap)

Chapter 16 Focused Ion Beam (FIB)

Chapter 17 Scanning Electron Microscopy (SEM)

Chapter 18 Transmission Electron Microscopy (TEM)

Chapter 19 Energy Dispersive X-ray spectroscopy (EDX)

Chapter 20 Use of additional materials analytical techniques and processes

Chapter 21 How should these results be used?

References

Appendix

List of figures

Index

Notes:

Electronic reproduction. Berlin Available via World Wide Web.

Description based on online resource; title from digital title page (viewed on December 28, 2022).

Other Format:

Print version: Sullivan, Daniel J. D. Failure Analysis

ISBN:

9781501524790

1501524798

9781501516474

1501516477

Publisher Number:

99993457124

Access Restriction:

Restricted for use by site license.