Electronic packaging science and technology / King-Ning Tu, Chih Chen, Hung-Ming Chen.

Format:

Book

Author/Creator:

Tu, K. N. (King-Ning), 1937- author.

Chen, Chih, 1970- author.

Chen, Hung-Ming, author.

Language:

English

Subjects (All):

Electronic packaging.

Physical Description:

1 online resource (330 pages)

Place of Publication:

Newark : John Wiley & Sons, [2022]

Summary:

"This book focuses on modern technology and how electronic packaging plays a major role in moving technology forward. With the enhancement of mobile technology and its challenges, the need for packing technology solutions is evident. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology"-- Provided by publisher.

Contents:

Electronic packaging.

Notes:

Description based on print version record.

Other Format:

Print version: Tu, King-Ning Electronic Packaging Science and Technology

ISBN:

9781119418337

111941833X

9781119418344

1119418348

9781119418320

1119418321

OCLC:

1289372266