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2022 3rd International Conference on Embedded & Distributed Systems (EDiS) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic data processing--Distributed processing--Congresses.
- Electronic data processing.
- Physical Description:
- 1 online resource (160 pages) : illustrations
- Other Title:
- 2022 3rd International Conference on Embedded & Distributed Systems
- Place of Publication:
- Piscataway, NJ : IEEE, 2022.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 979-83-503-9754-3
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