MEMS silicon oscillating accelerometers and readout circuits / editor, Yong Ping Xu.

Format:

Book

Contributor:

Xu, Yong Ping, editor.

Series:

River Publishers series in circuits and systems.

River Publishers series in circuits and systems

Language:

English

Subjects (All):

Accelerometers.

Physical Description:

1 online resource (314 pages).

Edition:

1st ed.

Place of Publication:

Gistrup, Denmark ; Delft, The Netherlands : River Publishers, [2019]

Summary:

The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.

Contents:

Cover

Half Title

Series Page

Title Page

Copyright Page

Table of Contents

Preface

List of Contributors

List of Figures

List of Tables

List of Abbreviations

List of Notations

1: Mechanical Design of Micromechanical Silicon Oscillating Accelerometer

1.1 Introduction

1.2 Mechanical Structure Design

1.2.1 Theory of Operation

1.2.2 Modelling of DETF Resonator for Closed-form Analysis

1.2.3 Micro Lever Mechanism and Amplification Factor

1.2.4 System Amplification Factor n´

1.2.5 Scale Factor

1.2.6 Bias

1.2.7 Thermal Sensitivity

1.2.8 Stiffness Nonlinearity

1.3 Fabrication and Testing

1.3.1 SOA Fabrication

1.3.2 Testing

1.4 Conclusion

References

2: Front-End Amplifiers for MEMS Silicon Oscillating Accelerometers

2.1 Capacitive Sensing in MEMS Sensors

2.2 Front-End Amplifiers for MEMS Oscillators

2.2.1 Single-Stage Resistive Feedback TIA

2.2.1.1 Stability and bandwidth

2.2.1.2 Input-referred noise

2.2.2 Two-Stage Resistive Feedback TIA

2.2.3 T-Network Resistive Feedback TIA

2.2.4 Charge-Sensing Amplifier (CSA)

2.2.5 Capacitive Feedback TIA

2.3 Front-End Amplifier for MEMS SOA

2.3.1 Concept of MEMS SOA and its Front-end

2.3.2 Continuous-Time Integrator-Differentiator-Based TIA

2.3.3 Discrete-Time Integrator-Differentiator-Based Amplifier

2.3.4 Front-end Based on Passive Charge Sensing

2.4 Summary

3: MEMS Silicon Oscillating Accelerometer Readout Circuit

3.1 Introduction

3.1.1 Concept of MEMS Silicon Oscillating Accelerometer (SOA)

3.1.2 Readout Circuits for MEMS SOA

3.1.3 Acceleration Noise Characterization

3.2 Readout Circuit

3.2.1 MEMS Oscillator

3.2.1.1 Front-End Amplifier

3.2.1.2 Oscillation-Sustaining Circuit

3.2.2 Amplitude Control

3.2.2.1 Amplitude-Stiffness Effect.

3.2.2.2 Noise Model of the AAC loop

3.2.3 Phase Noise of the MEMS Oscillator

3.3 Circuit Implementation

3.3.1 Overall Readout Circuit at System Level

3.3.2 Front-End Amplifier

3.3.3 AAC Circuits

3.3.4 Amplitude Detector

3.3.5 Buffer

3.3.6 Error Amplifier

3.3.7 Variable Gain Amplifier (VGA)

3.4 Performance

3.5 Conclusion

4: An MEM Silicon Oscillating Accelerometer Employing a PLL and a Noise Shaping Frequency-to-Digital Converter

4.1 Introduction

4.2 PLL-Based MEMS SOA

4.2.1 Noise Aliasing

4.2.2 Start-up Issue

4.2.3 PLL Phase Tracking

4.3 PLL-Based Sigma-Delta FDC

4.3.1 A Brief Review of Existing FDCs

4.3.1.1 Reset Counter-based FDC

4.3.1.2 Delta-Sigma FDC ( FDC)

4.3.1.3 PLL-Based FDC (PLL-FDC)

4.3.2 A Modified PLL-Based FDC (MPLL-FDC)

4.3.3 Analysis of Quantization Error in MPLL-FDC

4.4 Stability of the PLL with a Hybrid PFD

4.5 Noises in PLL-Based MEMS SOA

4.6 Key Circuit Designs for PLL-based MEMS SOA

4.6.1 Analog Front-End Amplifier

4.6.2 Hybrid Mode Phase Frequency Detector

4.6.3 Phase-Lock Loop with FDC

4.7 Experiment Results of a Prototype PLL-based MEMS SOA

4.7.1 Prototype Implementation

4.7.2 FDC Measurement Results

4.7.3 MEMS SOA Measurement Results

4.8 Conclusion

5: A System-Decomposition Model for MEMS Silicon Oscillating Accelerometer

5.1 Introduction

5.2 Silicon Oscillating Accelerometer

5.3 Noise Sources

5.3.1 Mechanical Noises

5.3.2 Electronic Noises

5.4 Noise Classification

5.4.1 Additive and Multiplicative Noises

5.4.2 Stiffness Modulation Noise

5.4.3 Noise Classification Examples

5.5 System Decomposition Model

5.5.1 Time-domain Decomposition for Damped MEMS Resonator

5.5.2 Frequency-domain Decomposition for Damped MEMS Resonator

5.5.3 Modulation Matrix.

5.5.4 Decomposition of a Practical MEMS Oscillation System

5.5.5 Phase Noise Modeling of Entire MEMS SOA Encompassing Nonlinearities

5.6 Noise Estimation with System Decomposition Phase Noise Model

5.7 Numerical Simulation

5.7.1 Performance Prediction

5.7.2 The Optimal MEMS Resonator Displacement Amplitude

5.8 Summary

6: Resonant Seismic Sensor

6.1 Introduction

6.2 Sensor Design

6.2.1 Sensor Topology

6.2.2 Mechanical Structure Design

6.2.3 Resonant Sensing Element

6.2.3.1 Analytical Model

6.2.3.2 Scale factor Optimization

6.2.3.3 Nonlinearity of Scale Factor

6.2.3.4 Conclusions

6.2.4 Inertial Force Amplifier

6.2.4.1 Micro-Leverage Mechanism

6.2.4.2 Lever Amplification Factor

6.2.4.3 Effective Amplification Factor

6.2.4.4 Conclusion

6.2.5 Proof Mass and Suspension Frame

6.2.5.1 Proof-Mass Design

6.2.5.2 Suspensions Design

6.2.6 Mechanical Structure Design Evaluation

6.3 Electronic Circuitry Design

6.3.1 Electro-Mechanical Transducer Design For DETF Sensing Element

6.3.2 Electro-Mechanical Model of DETF Sensing Element

6.3.2.1 Linear model of DETF sensing element

6.3.2.2 Nonlinear model of DETF sensing element

6.3.3 Design of Frequency Tracking Oscillator

6.3.4 Conclusion

6.4 Seismic Acceleration Resolution

6.4.1 Frequency Noise Model

6.4.1.1 PSD of phase/frequency noise

6.4.1.2 Allan variance

6.4.2 Factors Influencing Resolution

6.4.2.1 Phase noise of the DETF sensing element

6.4.2.2 Noise in semiconductor amplifiers

6.4.2.3 Noise in the frequency tracking oscillator

6.4.3 Estimation of Resonant Seismic Sensors' Resolution

6.4.3.1 Mechanical-thermal noise limited resolution

6.4.3.2 Electronic noise-limited resolution

6.4.3.3 Combinative resolution estimation

6.4.4 Conclusion.

6.5 Drift in Resonant Seismic Sensors

6.5.1 Temperature Drift

6.5.1.1 Temperature-dependent elasticity

6.5.1.2 Thermal expansion and thermal stress

6.5.1.3 Temperature-dependent DC bias voltage

6.5.2 Pressure-Induced Drift

6.5.3 Charge-Induced Drift

6.6 Device Fabrication and Integration

6.6.1 Micromachining Process

6.6.2 Low Pressure Package

6.6.3 Laboratory Calibration and Results

6.6.3.1 Experimental Setup

6.6.4 Static Calibration

6.6.4.1 Accelerometer Scale Factor

6.6.4.2 Accelerometer Resolution

6.6.5 Dynamic Calibration

6.6.6 Conclusion

Index

About the Editor.

Notes:

Description based on print version record.

ISBN:

1-00-333882-8

1-000-79689-2

1-003-33882-8

1-000-79373-7

87-7022-044-1

9781003338826

OCLC:

1090023490