Bogatin's Practical Guide to Prototype Breadboard and PCB Design / Eric Bogatin.

Format:

Book

Author/Creator:

Bogatin, Eric, author.

Language:

English

Subjects (All):

Printed circuits.

Physical Description:

1 online resource (521 pages)

Edition:

First edition.

Place of Publication:

Boston, MA : Artech House, [2021]

Summary:

This book focuses on the understanding of the Cylindrical Dielectric Resonator Antennas (CDRA). The book introduces the fundamentals of DRA, CDRA, identifying the modes in a CDRA, excitation techniques and recent advancements pertaining to the research of the CDRAs. The latest trends in the field are discussed, including wide bandwidth of operation, high gain, modal stability, mode and impedance matching techniques, Circularly Polarized CDRAs, beam forming and MIMO applications for modern wireless systems. The experimental validation, testing, fabrication methods and machining to achieve cylindrical and its reformed shapes are also presented.

Contents:

BOGATIN'S PRACTICAL GUIDE to PROTOTYPE BREADBOARD and PCB DESIGN

Table of Contents

Chapter 1 A Getting-Started Guide

1.1 Who This Book Is For

1.2 Getting Stuff Done

1.3 Cost-Performace Trade-offs

1.4 Errors, Best Practices, and Habits

1.5 Learn to Design-in Success

1.6 A Getting-Started Guide for Signal Integrity

1.7 The Seven-Step Process

1.8 Risk Management and Mitigation

1.9 Two Risk Management Design Strategies

1.0 Master of Murphy's Law

1.11 Proof of Concept

1.12 Practice Questions

Chapter 2 PCB Technology

2.1 PCB, PWB, or PCA?

2.2 Physical Design of a PCB

2.3 Vias Technologies

2.4 Thermal and Thermal Relief Vias

2.5 Other Layers

2.6 The Soldermask Layer

2.7 Surface Finishes

2.8 The Silk Screen

2.9 What the Fab Vendor Needs

2.10 Practice Questions

Chapter 3 Signal Integrity and Interconnects

3.1 Transparent Interconnects

3.2 When Interconnets are NOT Transparent

3.3 Where Signal Integrity Lives

3.4 Six Categories of Electrical Noise

3.5 Families of SI/PI/EMI Problems

3.6 In Principle and In Practice

3.7 Net Classes and Interconnect Problems

3.9 Design for X

3.10 Practice Questions

Chapter 4 Electrical Properties of Interconnects

4.1 Ideal vs Real Circuit Elements

4.2 Equivalent Electrical Circuit Models

4.3 Parasitic Extraction of R, L, and C Elements

4.4 Describing Cross Talk

4.5 Estimating Mutual Inductance

4.6 Training Your Engineer's Mind's Eye

4.7 Electrically Long Interconnects

4.8 Electrically Short and Electrically Long

4.9 Practice Questions

Chapter 5 Trace Width Considerations: Max Current

5.1 Best design practices

5.2 Minimum Fabrication Trace Width

5.3 Copper Thickness as Ounces of Copper

5.4 Maximum Current Handling of a Trace

5.5 Maximum Current Through a Via.

5.6 Thermal Runaway with Constant Current

5.7 Practice Questions

Chapter 6 Trace Width Considerations: Series Resistance

6.1 Resistance of Any Uniform Conductor

6.2 Sheet Resistance of a Copper Layer

6.3 Measuring Very Low Resistances

6.4 Voltage Drop Across Traces

6.5 The Thevenin Model of a Voltage Source

6.6 How Much Trace Resistance Is too Much?

6.7 The Resistance of a Via

6.8 Resistance of a Thermal Relief Via

6.9 Practice Questions

Chapter 7 The Seven Steps in Creating a PCB

7.1 Step 1: Plan of Record

7.2 Step 2: Create the BOM

7.3 Step 3: Complete the Schematic

7.4 Step 4: Complete the Layout, Order the Parts

7.5 Steps 5 and 6: Assembly and Bring-Up

7.6 Step 7: Documentation

7.7 Practice Questions

Chapter 8 Step 1, POR: Risk Mitigation

8.1 Visualize the Entire Project Before You Begin

8.2 Avoid Feature Creep

8.3 Estimate Everything You Can

8.4 Preliminary BOM: Critical Components

8.5 Risk Assessment

8.6 Risk Mitigation: Tented Vias

8.7 Risk Mitigation: Qualified Parts

8.8 Practice Questions

Chapter 9 Risk Reduction: Datasheets, Reverse Engineering, and Component Selection

9.1 Take Responsibility for Your Design

9.2 Reducing the Risk of a Design Problem

9.3 Understand Your Circuit

9.4 Read Datasheets Critically

9.5 Build Simple Evaluation Prototypes

9.6 Reverse Engineer Components

9.7 Reuse Parts

9.8 Practice Questions

Chapter 10 Risk Reduction: Virtual and Real Prototypes

10.1 Getting Started with Circuit Simulation

10.2 Practice Safe Simulation

10.3 Simulating a 555 Circuit

10.4 Purchase an Evaluation Board

10.5 Real Prototypes with Modules

10.6 Practice Questions

Chapter 11 Risk Reduction: Prototyping with a Solderless Breadboard

11.1 Build a Real Prototype

11.2 Solderless Breadboards for POC.

11.3 Features of a Solderless Breadboard

11.4 Bandwidth Limitations

11.5 A Simple Breakout Board

11.6 The Mini Solderless Breadboard

11.7 Best Wiring Habits

11.8 Habit #1: Consistent Column Assignments

11.9 Habit #2: Color Code the Wires

11.10 Habit #3: Keep Signal Traces Short

11.11 Habit #4: Avoid a Shared Return Path

11.12 Habit #5: Route Signal-Return Pairs

11.13 Habit #6: Keep Component Leads Short

11.14 Practice Questions

Chapter 12 Switching Noise and Return Path Routing

12.1 The Origin of Switching Noise

12.2 Signal-Return Path Loops

12.3 Where Does Return Current Flow?

12.4 A Plane as a Return Path

12.5 Ground

12.6 Avoid Gaps in the Return Plane

12.7 Summary of the Best design practices

12.8 Practice Questions

Chapter 13 Power Delivery

13.1 Origin of Power Rail Switching Noise

13.2 Calculating Loop Inductance

13.3 Measuring PDN Switching Noise

13.4 The Role of Decoupling Capacitors

13.5 Where Do Decoupling Capacitors Go?

13.6 The Power Delivery Path

13.7 Inrush Current

13.8 Summary of the Eight Habits for Using a SSB

13.9 Practice Questions

Chapter 14 Design for Performance: The PDN on a PCB

14.1 VRM specifications

14.2 Voltage Regulator Module

14.3 Self- and Mutual-Aggression Noise

14.4 Power and Ground Loop Inductance

14.5 Decoupling Capacitors

14.6 A Decoupling Capacitor Myth

Part 1

14.7 A Decoupling Capacitor Myth

Part 2

14.8 Routing for Power Distribution

14.9 Ferrite Beads

14.10 Summary of the Best design practices

14.11 Practice Questions

Chapter 15 Risk Reduction: Design for Bring-Up

15.1 Test is Too General a Term

15.2 What Does It Mean to "Work"?

15.3 Design for Bring-Up

15.4 Add Design for Bring-Up Features

15.5 Jumper Switches

15.6 LED indicators

15.7 Test Points.

15.8 The Power Rail as a Diagnostic

15.9 Practice Questions

Chapter 16 Risk Reduction: Design Reviews

16.1 The Preliminary Design Review

16.2 The Critical Design Review

16.3 DRC for DFM in the CDR

16.4 DRC for Signal Integrity

16.5 Layout Review

16.6 Practice Questions

Chapter 17 Step 2: Surface-Mount or Through-Hole Parts

17.1 Through-Hole and Surface-Mount

17.2 Types of SMT Parts

17.3 Integrated Circuit Components

17.4 Practice Questions

Chapter 18 Finding the One Part in a Million

18.1 An Important Selection Process

18.2 Trade-offs in Selecting Parts

18.3 The Search Order to Select a Part

18.4 Selecting Resistors

18.5 Selecting Capacitors

18.6 The BOM

18.7 Summary of the Best Design Practices

18.8 Selecting Parts for Automated Assembly

18.9 Practice Questions

Chapter 19 Step 3: Schematic Capture and Final BOM

19.1 Picking a Project Name

19.2 Schematic Capture

19.3 Take Ownership of Reference Designs

19.4 Add Options to Your Schematic

19.5 Best design practices for Schematic Entry

19.6 Design Review and ERC

19.7 Practice Questions

Chapter 20 Step 4: Layout - Setting Up the Board

20.1 Layout

20.2 Board Dimensions

20.3 The Layers in a Board Stack

20.4 Negative and Positive Layers

20.5 Examples of Some Fab Shop DFM Features

20.6 Setting Up Design Constraints

20.7 Thermal Reliefs in Pads and Vias

20.8 Set Up Board Size and Keepout Layer

20.9 Practice Questions

Chapter 21 Floor Planning and Routing Priority

21.1 Part Placement

21.2 The Order of Placement and Routing

21.3 First Priority: Ground Plane on the Bottom Layer

21.4 Second Priority: Decoupling Capacitors

21.5 Third Priority: Ground Connections

21.6 Fourth Priority: Digital Signals, Congested Signals

21.7 Fifth Priority: Power Paths.

21.8 The Silk Screen

21.9 Check the Soldermask

21.10 Soldermask Color

21.11 Layout - Critical Design Review

21.12 Practice Questions

Chapter 22 Six Common Misconceptions about Routing

22.1 Myth #1: Avoid 90 Deg Corners

22.2 Myth #2: Add Copper Pour on Signal Layers

22.3 Myth #3: Use Different Value Decoupling Capacitors

22.4 Myth #4: Split Ground Plan

22.5 Myth #5: Use Power Planes

22.6 Myth #6: Use 50 Ohm Impedance Traces

22.7 Practice Questions

Chapter 23 Four-Layer Boards

23.1 Two-Layer Stack-Ups

23.2 A 4-Layer Board

23.3 Four-Layer Stack-Up Options

23.4 Stack-Up Options with Two Planes

23.5 The Recommended 4-Layer Stack-Up

23.6 When Signals Change Return Planes

23.7 Practice Questions

Chapter 24 Release the Board to the Fab Shop

24.1 Gerber Files

24.2 Cost Adders

24.3 Board Release Checklist

24.4 Practice Questions

Chapter 25 Step 6: Bring-Up

25.1 Does Your Widget Work?

25.2 Prototype or Production Testing

25.3 Design for Bring-Up

25.4 Find the Root Cause

25.5 Problems to Expect

25.6 Troubleshoot Like a Detective

25.7 Trick #1: Recreate the Problem

25.8 Trick #2: Seen This Problem Before?

25.9 Trick #3: Round Up the Usual Suspects

25.10 Trick #4: Three Possible Explanations

25.11 A Methodology

25.12 Forensic Analysis

25.13 Coding Issues

25.14 Practice Questions

Chapter 26 Step 7: Documentation

Chapter 27 Concluding Comments

Chapter 28 About Eric Bogatin.

Notes:

Description based on publisher supplied metadata and other sources.

Description based on print version record.

Includes bibliographical references.

OCLC:

1288427904