Optical and EUV Nanolithography XXXV. Volume 12051 / edited by Anna Lio, Martin Burkhardt.

Format:

Book

Contributor:

Burkhardt, Martin, editor.

Lio, Anna, editor.

Language:

English

Subjects (All):

Nanotechnology--Congresses.

Nanotechnology.

Physical Description:

1 online resource (8 pages)

Place of Publication:

[Place of publication not identified] : SPIE, 2022.

Summary:

This PDF file contains the front matter associated with SPIE Proceedings Volume 12051, including the Title Page, Copyright information, Table of Contents, and Conference Committee listings.

Contents:

EUV optics: status, outlook and future Author(s): Paul Graeupner; Peter Kuerz; Thomas Stammler; Jan van Schoot; Judon Stoeldraijer

Role of ion accumulation in lofting of submicrometer-sized dielectric particle from dielectric surface by plasma and low-energy electron beam Author(s): Pavel Krainov; Vladimir Ivanov; Dmitry Astakhov; Slava Medvedev; Mark van de Kerkhof

Impact of mask variations on CD and placement in resist: local versus global effects Author(s): Guillaume Mernier; Danielle Palmen; Nicole Schoumans; Marieke van Veen; Rasmus Nielsen; Jan Baselmans

Calibration of Gaussian random field stochastic EUV models Author(s): Azat Latypov; Chih-I Wei; Peter De Bisschop; Gurdaman Khaira; Germain Fenger

Improvement of local CDU by using low speckle imaging Author(s): Hyounghwa Jin; Yongwoo Kim; Harim Oh; Jaehyung Jung; Jaewoong Sohn; Woosung Jin; Kangyeol Yun; Hyosung Lee

Technology development progress of digital scanner Author(s): Yoji Watanabe; Yuho Kanaya; Yusuke Saito; Toshiaki Sakamoto; Soichi Owa; Thomas Koo; Rocky Mai; David Tseng; Conrad Sorensen; Hwan Lee; Stephen Renwick; Noriyuki Hirayanagi; Bausan Yuan

A novel solution on KrF pixel layer with thick photo resist (PR) by single exposure multi-focal imaging (SE MFI) technique Author(s): Zhenhai Yao; Lequn Jin; Yuhua Li; Maoqun Jiang; Fabin Huang; Min Fang; Xichen Sheng; Rongkuo Zhao; Michael Crouse; Chris Kaplan; Dongqing Zhang; Dongxiang Shi; Zhonghua Xu; Chaoqun Guo; Pieter Scheijgrond; Xiaoyang Jason Li; Stephen Hsu; Will Conley; Zhen Tang

AIMS EUV evolution towards high NA: challenge definition and solutions implementation Author(s): Renzo Capelli; Grizelda Kersteen; Sven Krannich; Markus Koch; Lukas Fischer; Matthias Roesch; Klaus Gwosch

High-transmission EUV pellicles supporting >400W source power Author(s): Mark van de Kerkhof; Alexander Klein; Paul Vermeulen; Ties van der Woord; Inci Donmez; Guido Salmaso; Raymond Maas

Focus considerations of design pitches and absorber choice for EUV random logic Author(s): Martin Burkhardt; Zheng Chen; Scott Halle; Romain Lallement; Stuart Sieg; Luciana Meli

Evaluation of Ta-Co alloys as novel high-k EUV mask absorber Author(s): Devesh Thakare; Meiyi Wu; Karl Opsomer; Christophe Detavernier; Philipp Naujok; Qais Saadeh; Victor Soltwisch; Annelies Delabie; Vicky Philipsen

Characterizing EMA modelled EUV absorbers for high reflectivity: high phase performance Author(s): Rajiv N. Sejpal; Bruce W. Smith

High NA EUV stochastic resist modeling considered with development parameters Author(s): R. Tsuzuki; X. Liu; K. Oyama

EUV and immersion lithography integration in 7nm FPGA production Author(s): Qi Lin; Nui Chong; Toshiyuki Hisamura; Jonathan Chang

Investigation of low-n mask in 0.33 NA EUV single patterning at pitch 28nm metal design Author(s): Dongbo Xu; Werner Gillijns; Ling Ee Tan; Vicky Philipsen; Ryoung-Han Kim

Logic via printability enhancement using restricted via placement and exhaustive SRAF placement on a staggered grid Author(s): Pieter Wöltgens; Alberto Colina; David Rio; Maxence Delorme; Tatiana Kovalevich; Arame Thiam; Frieda van Roey; Odysseas Zografos

Orthogonal array pillar process development for high density 4F2 memory cells at 40nm pitch and beyond Author(s): Murat Pak; Wesley Zanders; Patrick Wong; Sandip Halder; Romuald Blanc; Laurent Souriau; Jeonghoon Lee; Gouri Sankar Kar

On-scanner high-spatial-frequency overlay control using a distortion manipulator Author(s): Friso Klinkhamer; Bart Smeets; Theo Thijssen; Francis Fahrni; Wim de Boeij; Mohamed El Kodadi; Thilo Pollak; Wolfgang Emer

On-product overlay solutions for DUV and EUV mix-scanner usage in an EPE-driven patterning world Author(s): D. M. Slotboom; P. Hinnen; J. Mulkens

Investigation of atomic emission from tin and heavier elements to heavier elements for further optimization and extension to shorter wavelength of the EUV sources Author(s): Akira Sasaki

Optimal thickness of phase shift mask considering phase and reflectance in high NA EUV contact-hole pattern Author(s): Jang-Gun Park; Min-Woo Kim; Ji-Won Kang; Hee-Chang Ko; Jun-Hyung Lee; Won-Young Choi; Hye-Keun Oh

EUV low-n attenuated phase-shift mask on random logic via single patterning at pitch 36nm Author(s): Ling Ee Tan; Werner Gillijns; Jae Uk Lee; Dongbo Xu; Jeroen van de Kerkhove; Vicky Philipsen; Ryoung-Han Kim

Pattern customization on 193 immersion lithography by negative tone development process and multiple exposures Author(s): Ivanie Mendes; Michael May; Jérôme Rêche; Raluca Tiron; Aurélien Sarrazin; Olivier Dubreuil

Integrated simulations of hybrid discharge-laser produced plasma devices for EUV metrology Author(s): V. Sizyuk; A. Hassanein; F. Melsheimer; L. Juschkin; T. Sizyuk

Impact of thermal expansion coefficient on the local tilt angle of extreme ultraviolet pellicle Author(s): Chang Soo Kim; Jung Hwan Kim; Seong Ju Wi; Ha Neul Kim; Young Woo Kang; Won Jin Kim; Jinho Ahn

Key technology development progress of the high power LPP-EUV light source Author(s): Yuichi Nishimura; Yoshifumi Ueno; Shinji Nagai; Fumio Iwamoto; Kenichi Miyao; Hideyuki Hayashi; Yukio Watanabe; Tamotsu Abe; Hiroaki Nakarai; Hakaru Mizoguchi

Simulation of a discharge produced plasma (DPP) for Blue-X (6.x nm) EUV radiation Author(s): D. B. Reisman; K. Saito; W. A. Neff.

Notes:

Description based on online resource; title from PDF title page (SPIE, viewed March 29, 2023).

ISBN:

1-5106-4978-6