Advanced Etch Technology and Process Integration for Nanopatterning X / edited by Julie Bannister and Nihar Mohant.

Format:

Book

Contributor:

Bannister, Julie, editor.

Mohant, Nihar, editor.

Language:

English

Subjects (All):

Nanoelectronics--Congresses.

Nanoelectronics.

Plasma etching--Congresses.

Plasma etching.

Extreme ultraviolet lithography--Congresses.

Extreme ultraviolet lithography.

Physical Description:

1 online resource : illustrations some color

Place of Publication:

Bellingham, Washington : Society of Photo-Optical Instrumentation Engineers (SPIE), 2021.

Contents:

Welcome and Introduction to SPIE Conference 11615 / Julie Bannister; Nihar Mohanty

Directional and selective patterning of EUV absorbers / Xia Sang; Yantao Xia; Jane P. Chang; Philippe Sautet

Module-level material engineering for continued DRAM scaling / Regina Freed

Key challenges and solutions in forthcoming device scaling / Kazuya Okubo; Song-Yun Kang

Line edge roughness (LER) reduction strategies for EUV self-aligned double patterning (SADP) / Eric Liu; Katie Lutker-Lee; Qiaowei Lou; Ya-Ming Chen; Angélique Raley; Peter Biolsi

Novel bottom-up organic mandrel growth to enable organic mandrel EUV SADP for sub-5nm node technologies / Katie Lutker-Lee; Emma Richardson; David O'Meara; Angélique Raley

Etch and deposition co-optimization: a pathway to enabling high aspect ratio 3D NAND Flash ONON channel hole patterning / Meihua Shen; John Hoang; Hao Chi; Danna Qian; George Papasouliotis; Jonathan Church; Pramod Subramonium; Eric Hudson; Leonid Belau; Katherine Haynes; Matt Weimer; Ragesh Puthenkovilakam; Sirish Reddy; Sonal Bhadauriya; Thorsten Lill

Contact local CD uniformity optimization through etch shrink / Eric Miller; Junling Sun; Jennifer Church; Xinghua Sun; Angelique Raley

Advanced multiple patterning technologies for high density hexagonal hole arrays / Nayoung Bae; Sophie Thibaut; Toshiharu Wada; Andrew Metz; Akiteru Ko; Peter Biolsi

Selective patterning using deposition and etch: case of area selective deposition / christophe vallee; Marceline Bonvalot; Taguhi Yeghoyan; Moustapha Jaffal; Nicolas Posseme; Remy Gassilloud; Thierry Chevolleau

Atomic level control of pattern fidelity during SAC etch / Mingmei Wang; Du Zhang; Shinya Morikita; Yanxiang Shi; Hojin Kim; Jeffery Lucas; Kensuke Taniguchi; Peter Biolsi

Quasi-atomic layer etching of Si and nitride hard mask with Cl2 based chemistry / Tao Li; Stefan Schmitz; Phil Friddle; Samantha Tan; Wenbing Yang; Indira Seshadri

3D integration and process effects in superconducting qubit devices / Bethany M. Niedzielski

Effect of surface temperature on GeSbTe damage formation during plasma processing / L. Buzi; J. M. Papalia; H. Miyazoe; H.-Y. Cheng; M. Hopstaken; R. L. Bruce; S. U. Engelmann

Reactive ion beam etch of slanted gratings for augmented reality / Vincent Ip; Frederick Pearsall; Tania Henry; Riju Singhal

Non-equilibrium plasma science and industries of the future / David Graves

Process trace analytics for process development / Robert J. Baseman; Fateh A. Tipu; Sebastian U. Englemann; John M. Papalia; Matthew Sagianis; Scott DeVries; Danielle Durrant; Sebastian Naczas; Vinay Pai; Shanti Pancharatnam

Parametric modeling of patterned object with variations and expert tuning of edge placement / B. Darbon; M. Grould; N. Clément; J. Baderot; S. Martinez; J. Foucher

Fast etch recipe creation with automated model-based process optimization / Yang Ban; Kara Kearney; Bryan Sundahl; Leandro Medina; Roger T. Bonnecaze; Meghali J. Chopra

EPE variability comparison study of multiple patterning options for restricted 2D structures in advanced logic nodes / Arup Saha; Brett Schroeder; Tsann-Bim Chiou; Fung Suong Ou

On-product overlay characterization after stressed layer etch / Richard van Haren; Orion Mouraille; Oktay Yildirim; Leon van Dijk; Kaushik Kumar; Yannick Feurprier; Jan Hermans.

Notes:

Description based on publisher supplied metadata and other sources.

ISBN:

1-5106-4064-9