Advanced Etch Technology and Process Integration for Nanopatterning XI / edited by Julie Bannister.

Format:

Book

Contributor:

Bannister, Julie, editor.

Language:

English

Subjects (All):

Analytical chemistry--Congresses.

Analytical chemistry.

Physical Description:

1 online resource (6 pages)

Place of Publication:

[Place of publication not identified] : SPIE, 2022.

Contents:

Challenge to achieve thermal atomic layer etching of non-volatile materials via stable organometallic complex formation / Yoshihide Yamaguchi; Sumiko Fujisaki; Kazunori Shinoda; Hiroyuki Kobayashi; Kiyohiko Sato; Kohei Kawamura; Kenji Maeda; Masaru Izawa Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures / John M. Papalia; Devi Koty; Nathan Marchack; Scott Lefevre; Qingyun Yang; Aelan Mosden; Sebastian U. Engelmann; Robert L. Bruce Patterning of Ru metal lines at 18nm pitch / Stefan Decoster; Souvik Kundu; Frédéric Lazzarino; Stéphane Larivière; Martin O'Toole; Gayle Murdoch; Quoc Toan Le; Marleen van der Veen; Nancy Heylen Tone reversal patterning for advanced technology nodes / F. Schleicher; J. Bekaert; A. Thiam; S. Decoster; R. Blanc; F. Lazzarino; J. Garcia Santaclara; G. Rispens; M. Maslow Dielectric material etch selectivity control in dual-frequency capacitively coupled plasmas with dc-superposition / Du Zhang; Hojin Kim; Kathleen McInerney; Pingshan Luan; George Rogalskyj; Mingmei Wang OPC accuracy improvement through deep-learning based etch model / Weina Shi; Liang Zhu; Yuqian Chen; Jiao Huang; Jinze Wang; Qian Xie; Bilun Zhang; Yunfei Xi; Wenhao Pan; Yuanxia Zheng; Yongfa Fan; Jin Cheng; Yu Zhao; Leiwu Zheng Automated, high throughput optimization of multistep and cyclic etch and deposition processes using SandBox Studio AI / Kara Kearney; Leandro Medina; Roger T. Bonnecaze; Meghali J. Chopra Study of surface interactions for encapsulation of phase change memory materials / L. Buzi; D. Koty; M. Hopstaken; J. Bruley; L. Gignac; M. Sagianis; D. Farmer; H. Miyazoe; A. Mosden; S. Engelmann; R. L. Bruce Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges / Angélique Raley; Lior Huli; Steven Grzeskowiak; Katie Lutker-Lee; Alexandra Krawicz; Yannick Feurprier; Eric Liu; Kanzo Kato; Kathleen Nafus; Arnaud Dauendorffer; Nayoung Bae; Josh LaRose; Andrew Metz; Dave Hetzer; Masanobu Honda; Tetsuya Nishizuka; Akiteru Ko; Soichiro Okada; Yasuyuki Ido; Tomoya Onitsuka; Shinichiro Kawakami; Seiji Fujimoto; Satoru Shimura; Cong Que Dinh; Makoto Muramatsu; Peter Biolsi; Hiromasa Mochiki; Seiji Nagahara Buried power rail integration for CMOS scaling beyond the 3 nm node / A. Gupta; Z. Tao; D. Radisic; H. Mertens; O. Varela Pedreira; S. Demuynck; J. Bömmels; K. Devriendt; N. Heylen; S. Wang; K. Kenis; L. Teugels; F. Sebaai; C. Lorant; N. Jourdan; B. T. Chan; S. Subramanian; F. Schleicher; A. Peter; N. Rassoul; Y. Siew; B. Briggs; D. Zhou; E. Rosseel; E. Capogreco; G. Mannaert; A. Sepúlveda; E. Dupuy; K. Vandersmissen; B. Chehab; G. Murdoch; E. Altamirano Sanchez; S. Biesemans; Zs. Tokei; E. Dentoni Litta; N. Horiguchi Middle-of-line plasma dry etch challenges for buried power rail integration / Dunja Radisic; A. Veloso; A. Gupta; M. Hosseini; S. Wang; H. Mertens; B. T. Chan; D. Batuk; G. T. Martinez; F. Lazzarino; E. D. Litta; N. Horiguchi Mitigation of the etch-induced intra-field overlay contribution / Richard van Haren; Oktay Yildirim; Orion Mouraille; Leon van Dijk; Kaushik Kumar; Yannick Feurprier; Christiane Jehoul; Jan Hermans Creating new multistep etch and deposition processes with recycled etch data using SandBox Studio AI / Kara Kearney; Leandro Medina; Roger T. Bonnecaze; Meghali J. Chopra Approaches to enable patterning of tight pitches towards high NA EUV / Hiroki Tadatomo; Arnaud Dauendorffer; Tomoya Onitsuka; Hisashi Genjima; Yasuyuki Ido; Soichiro Okada; Yuhei Kuwahara; Arisa Hara; Congque Dinh; Seiji Fujimoto; Shinichiro Kawakami; Makoto Muramatsu; Satoru Shimura; Kathleen Nafus; Noriaki Oikawa; Kenta Ono; Yannick Feurprier; Marc Demand; Ainhoa Romo Negreira; Seiji Nagahara; Blanco Victor; Philippe Foubert; Danilo De Simone.

Notes:

Description based on online resource; title from PDF title page (SPIE, viewed May 3, 2023).

ISBN:

1-5106-4988-3