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2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Place of Publication:
- Piscataway, NJ : IEEE, 2022.
- Contents:
- Agenda
- Plenary Speech
- Welcome Message from Chih-I Wu, Conference General Chair
- Committee Member
- Index
- Copyright
- IMPACT 2022 Cover Page
- Copyright Page
- Title Page
- Root Cause of Analysis on the FCCL Delamination of Rigid Flexible Board
- Research on the Thermal Cycle Test Performance Improving in Automotive R-F PCB
- High Temperature Resistant Protection Tape For Panel Level Embedded Chip Package On Substrate.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781665452212
- 1665452218
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