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2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author, issuing body.
- Language:
- English
- Subjects (All):
- Electronic industries--Congresses.
- Electronic industries.
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource : illustrations
- Other Title:
- 2022 IEEE 39th International Electronics Manufacturing Technology Conference
- Place of Publication:
- Piscataway, NJ : IEEE, 2022.
- Contents:
- Enable Detection and Classification of Abnormal Molding Process through Systematic Advanced Process Control (APC)
- Semiconductor Manufacturing Case Studies: Wedge Bonder Characterization via Advanced Process Control (APC)
- Modified Multipoint Constraints of Finite Element Model for SJR Prediction Accuracy
- Single Side Direct Cooling SiC Module Baseplate Warpage Behavior and Solutions
- Solvent Cleaning to Clean Die from Fluorine After BOSCH Plasma Dicing
- SSDC SiC Mosfet Panel Warpage Challenges at Sintering Process
- Critical Cleaning Requirements to Overcome Advanced Packaging Defluxing Challenges
- Detailed Analysis of Conductive Die Attach Film in Miniature Package X3DFN
- Package Fault Isolation for Low Density and Non-Metallic Particle Analysis.
- Notes:
- Description based on publisher supplied metadata and other sources.
- ISBN:
- 9781665471701
- 1665471700
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