1 option
ICEP-IAAC : 2018 International Conference on Electronics Packaging and IMAPS All Asia Conference : Hotel Hanamizuki, Kuwana, Mie, Japan : April 17-21 / sponsored by Japan Institute of Electronics Packaging [and three others].
- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference on Electronics Packaging (2018 : Mie-ken, Japan)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (584 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed May 6, 2020).
- ISBN:
- 4-9902188-5-X
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