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2018 IEEE 20th Electronics Packaging Technology Conference : 4-7 December 2018, Singapore / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE Electronics Packaging Technology Conference (20th : 2018 : Singapore)
- Language:
- English
- Subjects (All):
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (503 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed April 15, 2020).
- ISBN:
- 1-5386-7668-0
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