1 option
DTIP 2018 : collection of papers presented at the Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS : Roma, Italy, May 22nd-25th, 2018 / editors, Frédérick Mailly [and six others] ; sponsored by Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Conference Name:
- Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (2018 : Rome, Italy)
- Language:
- English
- Subjects (All):
- Microelectronic packaging--Congresses.
- Microelectronic packaging.
- Microelectromechanical systems--Congresses.
- Microelectromechanical systems.
- Physical Description:
- 1 online resource (181 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed May 13, 2020).
- ISBN:
- 1-5386-6199-3
The Penn Libraries is committed to describing library materials using current, accurate, and responsible language. If you discover outdated or inaccurate language, please fill out this feedback form to report it and suggest alternative language.