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Proceedings for 2018 IEEE COOL Chips 21 : IEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Conference/Event
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author.
- Conference Name:
- IEEE Symposium on Low-Power and High-Speed Chips (21st : 2018 : Yokohama-shi, Japan)
- Language:
- English
- Subjects (All):
- Integrated circuits--Congresses.
- Integrated circuits.
- Very high speed integrated circuits--Congresses.
- Very high speed integrated circuits.
- Physical Description:
- 1 online resource (71 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed April 25, 2020).
- ISBN:
- 1-5386-6103-9
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