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2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium : 16-18 December 2018, Chandigarh, India / Institute of Electrical and Electronics Engineers.
IEEE Xplore (IEEE/IET Electronic Library - IEL) Available online
IEEE Xplore (IEEE/IET Electronic Library - IEL)- Format:
- Book
- Conference/Event
- Conference Name:
- IEEE Electrical Design of Advanced Packaging and Systems Symposium (2018 : Chandigarh, India)
- Language:
- English
- Subjects (All):
- Electronic packaging--Design and construction--Congresses.
- Electronic packaging.
- Electronic systems--Design and construction--Congresses.
- Electronic systems.
- Physical Description:
- 1 online resource (54 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed April 23, 2020).
- ISBN:
- 1-5386-6592-1
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