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2018 20th International Conference on Electronic Materials and Packaging : 17-20 December 2018, Clear Water Bay, Hong Kong / IEEE Electronics Packaging Society.
- Format:
- Book
- Conference/Event
- Conference Name:
- International Conference on Electronic Materials and Packaging (20th : 2018 : Clear Water Bay, Hong Kong)
- Language:
- English
- Subjects (All):
- Microelectronics--Congresses.
- Microelectronics.
- Electronic packaging--Congresses.
- Electronic packaging.
- Physical Description:
- 1 online resource (57 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed April 2, 2020).
- ISBN:
- 1-5386-5642-6
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