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IWLPC : 2018 International Wafer Level Packaging Conference : San Jose, CA, USA, October 23-25, 2018 / Institute of Electrical and Electronics Engineers.
- Format:
- Book
- Author/Creator:
- Institute of Electrical and Electronics Engineers, author.
- Language:
- English
- Subjects (All):
- Electronic apparatus and appliances--Packaging--Congresses.
- Electronic apparatus and appliances.
- Semiconductors--Packaging--Congresses.
- Semiconductors.
- Physical Description:
- 1 online resource (297 pages)
- Place of Publication:
- Piscataway, New Jersey : Institute of Electrical and Electronics Engineers, 2018.
- Notes:
- Description based on: online resource; title from pdf title page (IEEE Xplore, viewed May 8, 2020).
- ISBN:
- 1-944543-06-6
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